WMSIC Electronic Components

cjiang FTC201208S4R7MBCA

ModelFTC201208S4R7MBCA
PackageSMD,1.2x2mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FTC201208S4R7MBCA
Type
CJIANG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FTC201208S4R7MBCA
Electronic Component
1
Package
SMD,1.2x2mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.037g
Inductor
4.7uH
Electronic Component
1
Electronic Component
BM0258760355
Current
1.7A
Resistor(DCR)
325mΩ
Electronic Component
Electronic Component
Electronic Component
3000
and Current(Isat)
1.6A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FTC201208S4R7MBCA 产品概述

一、产品简介

FTC201208S4R7MBCA 是长江微电(cjiang/长江微电)推出的一款片式功率电感,尺寸紧凑(SMD 1.2×2.0 mm),面向空间受限的电源滤波与降压转换器应用。该器件具有标称电感量 4.7 µH,公差 ±20%,适合用于小尺寸开关电源、便携及物联网终端等对体积与电流能力有平衡要求的场合。

二、主要参数

  • 电感值:4.7 µH,公差 ±20%
  • 额定电流:1.7 A(连续允许电流,受温升限制)
  • 饱和电流(Isat):1.6 A(在直流偏置下电感显著下降的参考值)
  • 直流电阻(DCR):约 325 mΩ
  • 封装形式:SMD,外形大约 1.2 × 2.0 mm
  • 品牌:cjiang(长江微电)

三、性能特点

  • 小型化:1.2×2 mm 的紧凑封装,便于高密度 PCB 布局。
  • 中低电感量:4.7 µH 适合对储能与滤波都有要求的中低频开关电源应用。
  • 中等电流能力:额定电流 1.7 A,可满足便携式设备及部分功率级的输入滤波或升降压用途。
  • DCR 较高:325 mΩ 表明器件在高电流下的功耗与温升需关注,对于效率敏感的系统应综合考虑损耗预算。
  • 直流偏置影响明显:饱和电流 1.6 A 提示在大电流工作时电感值会下降,设计时应考虑直流偏置导致的有效电感减小。

四、典型应用

  • 手机、智能穿戴与可穿戴设备的电源滤波与储能
  • 物联网终端、蓝牙/低功耗模块的降压/升压转换器输出电感
  • 小功率消费电子与通信设备的 EMI 滤波和输入电源滤波
  • 电池供电系统的局部去耦与能量储存

五、选型与使用建议

  • 电流余量:建议在实际工作电流下留出裕量(通常按 70–80% 的额定电流进行选型),以避免长期温升或接近饱和引起的性能退化。
  • 注意直流损耗:DCR 325 mΩ 在高电流时会带来明显损耗,若效率为优先项,可考虑并联多个线圈或选择低 DCR 型号。
  • 考虑直流偏置:Isat 1.6 A 以下时电感值会下降,DC-DC 设计中应评估偏置下的实际电感与环路性能。
  • 布局与散热:靠近电源器件放置,缩短回流路径,必要时在封装下方或周围增加过孔/散热铜箔以降低温升。

六、封装与可靠性

  • SMD 形式适合常规回流焊工艺,便于自动贴装与批量生产。
  • 小型封装对机械应力与焊接质量敏感,推荐遵循厂商的焊接与回流曲线(若无详细曲线,应采用通用的无铅回流规范并做好首件验证)。
  • 在高温或高湿环境使用时,应进行热循环与潮湿测试验证长期可靠性。

七、检验与品质控制

  • 建议在样机阶段进行直流偏置的电感-电流曲线测试、温升测试以及效率对比实验。
  • 关注批次一致性,验收时对电感值、DCR 与额定/饱和电流进行抽样确认。
  • 对于关键应用,建议与供应商沟通样品测试报告与可靠性数据。

总结:FTC201208S4R7MBCA 以其小型封装和中等电流能力,适合体积受限的电源与滤波场景。但在高电流或高效率场合需重点关注 DCR 与饱和特性,合理预留余量并优化 PCB 布局与散热。

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