WMSIC Electronic Components

cjiang FTC201210S100MBCA

ModelFTC201210S100MBCA
PackageSMD,1.2x2mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FTC201210S100MBCA
Type
CJIANG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FTC201210S100MBCA
Electronic Component
1
Package
SMD,1.2x2mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.038g
Inductor
10uH
Electronic Component
1
Electronic Component
BM0257252641
Current
1.1A
Resistor(DCR)
660mΩ
Electronic Component
Electronic Component
Electronic Component
3000
and Current(Isat)
1.2A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FTC201210S100MBCA 产品概述

一、产品简介

FTC201210S100MBCA 是长江微电(cjiang)推出的一款表面贴装功率电感,电感值为 10 μH,公差±20%,额定电流(Irated)1.1 A,饱和电流(Isat)1.2 A,直流电阻(DCR)约 660 mΩ。封装为 SMD,外形尺寸约 1.2 × 2.0 mm,针对空间受限、对电感值要求中等且电流在 1A 量级的低功耗开关电源与滤波场景设计。

二、主要特性

  • 小型封装(1.2×2 mm),便于高密度布板与小型化终端产品集成。
  • 10 μH ±20% 的中等电感值,适合用于能量存储与滤波。
  • 额定电流 1.1 A、饱和电流 1.2 A,适合轻载至中等负载的 DC-DC 降压转换器和电源滤波。
  • 较高的直流电阻(约 660 mΩ)提示在较大直流通过时会产生明显功耗和压降,需在系统设计中权衡效率与体积。

三、典型应用

  • 便携式设备和物联网终端的降压型 DC-DC 转换器(电流预算在 1A 左右)。
  • 电源输入滤波与 EMI 抑制,减小纹波和高频干扰。
  • 传感器供电与低功率模块的能量储存元件。
    注:对于需高效率或较大电流的场合,应考虑更低 DCR 或更大体积的功率电感件。

四、电气性能与设计注意事项

  • DCR 与功耗:器件 DCR ≈ 0.66 Ω,器件导通损耗 Ploss = I_rms^2 × DCR。按额定电流 1.1 A 计算,Ploss ≈ 0.8 W,此为理论电阻损耗值,实际电路中温升与频率相关损耗需综合评估。建议在设计中对额定电流进行降额(例如 70%–80%),以控制温升与效率损失。
  • 饱和特性:当电流接近或超过 Isat(1.2 A)时,电感量将显著下降,可能影响开关电源的稳定与输出纹波。若工作点接近 Isat,必须参考厂商的电感随直流电流变化的曲线(L–I 曲线)进行核算。
  • 频率响应:电感在不同频率下的感抗 XL = 2πfL。举例:在 100 kHz 时 XL ≈ 6.28 Ω;在 1 MHz 时 XL ≈ 62.8 Ω。根据工作频率选择合适电感值与评估滤波效果。
  • 容差影响:±20% 的公差会直接影响谐振频率与滤波深度,设计滤波或谐振电路时应考虑该偏差带来的最坏情况。

五、封装与装配建议

  • 该器件为 SMD 贴片,兼容常规回流焊工艺。建议遵循厂商提供的回流温度曲线与焊接规范,避免超温或重复加热导致性能退化。
  • PCB 布局建议:器件两端尽量采用短且宽的连线以减小寄生电阻与电感;若需要散热,可在焊盘处增加焊盘铜量或下层过孔以改善热扩散。
  • 防震与机械应力:小尺寸封装对焊接强度与机械应力较敏感,搬运、贴片与回流过程中注意避免过度机械力。

六、选型建议与替代方案

  • 若系统对效率要求高或工作电流较大(>1.1 A),建议优先选用 DCR 更低、Isat 更高的电感或通过增加封装体积来换取更低损耗。
  • 若空间极其受限且电流较低,这款 1.2×2 mm 的产品能有效节省 PCB 空间。
  • 选型时应综合考量电感值、DCR、饱和电流与热管理方案,并在关键参数接近极限时进行实测验证(包括温升、L–I 曲线与频率响应)。

七、结语

FTC201210S100MBCA 以其超小尺寸和 10 μH 的电感值,适合对体积敏感且电流在 1A 量级的低功耗电源设计与滤波应用。在使用时应特别关注较高的 DCR 带来的功耗与压降,并留足电流降额与热管理余量。为确保系统可靠性,建议在最终方案中结合厂家的详细数据手册和实际测量结果进行评估与验证。

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