WMSIC Electronic Components

cjiang FXL0630-150-M FXL0630

ModelFXL0630-150-M
PackageSMD,6.6x7mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FXL0630-150-M
Type
SMD, 6.6X7MM
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FXL0630-150-M
Electronic Component
1
Package
SMD,6.6x7mm
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
1.026g
Inductor
15uH
Electronic Component
1
Electronic Component
BM0230864113
Current
3A
Resistor(DCR)
115mΩ
Electronic Component
Electronic Component
Electronic Component
1500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FXL0630-150-M 产品概述

一、产品简介

FXL0630-150-M 是长江微电(cjiang)推出的一体成型功率电感,标称电感值 15 μH,公差 ±20%,为表面贴装(SMD)封装,外形尺寸约 6.6 × 7 mm。针对开关电源与电源滤波场合优化设计,适合中小功率 DC-DC 变换器、LED 驱动与电源管理模块。

二、主要规格参数

  • 电感值:15 μH(±20%)——实际范围约 12 μH 至 18 μH
  • 额定电流:3.0 A(连续)
  • 饱和电流 Isat:4.0 A(电感降至指定比例时)
  • 直流电阻 DCR:115 mΩ(典型)
  • 类型:一体成型功率电感(SMD)
  • 封装尺寸:6.6 × 7 mm
  • 品牌:cjiang(长江微电)

三、关键性能特点

  • 高电流能力:3A 连续工作,短时峰值接近 4A,适合中等电流输出的降压/升压拓扑。
  • 成型结构:机械强度和焊接可靠性高,适合回流焊工艺。
  • 低体积化:小尺寸满足空间受限的电源模组布局需求。
  • 注意:DCR 相对较高(115 mΩ),在大电流时铜损显著(例如 3A 时约 1.04 W),需在热管理上做好考虑。

四、典型应用场景

  • 同步/非同步降压(Buck)转换器
  • LED 驱动与恒流源电路
  • 电池管理与移动电源模块
  • 工业控制电源与点载板级电源滤波

五、选型与使用建议

  • 电流余量:建议实际工作电流低于额定电流 80–90% 以降低温升并避免磁饱和。
  • 电感容差:±20% 公差对输出纹波和控制环路影响较大,若纹波要求严格请选择更小公差型号或并联方案。
  • 损耗评估:按 P = I^2·DCR 估算铜损并核算散热条件,必要时提升散热或选用更低 DCR 型号。
  • 高频特性:在高开关频率下,核心损耗和有效电感下降,应参考厂方阻抗/损耗曲线进行仿真验证。

六、PCB 布局与焊接建议

  • 尽量缩短与电感相连的电流回路路径,减小环路面积以降低 EMI。
  • 电感引脚与电容、器件的布局应保证稳固的焊盘与铜箔过孔散热通路。
  • 回流焊推荐遵循 JEDEC/J‑STD 规范的温度曲线,焊接参数以厂方数据表为准。

七、可靠性与检测

  • 建议进行过电流、温升与长时间热循环测试,关注电感在额定电流下的温升与电感值漂移。
  • 产测项目包含 L、DCR 测量及电流阶跃测试以确认饱和行为。对高可靠性应用可要求样品批次做老化和振动测试。

八、封装与采购提示

  • 尺寸 6.6×7 mm 的 SMD 封装适合自动化贴装,常见为卷带(Reel)供货。
  • 订购时确认完整型号及批次,索取数据表以获得完整电气/热/机械与回流焊规范信息。

如需进一步的频率响应、饱和曲线或样品评估报告,可联系供应商或索取 FXL0630-150-M 的详细资料与测试样品。

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