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cjiang FTC322512SR47MBCA
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- cjiang FTC322512SR47MBCA
- Type
- CJIANG
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJIANG
- Electronic Component
- FTC322512SR47MBCA
- Electronic Component
- 1
- Package
- SMD,2.5x3.2mm
- Electronic Component
- Power Inductor
- Electronic Component
- ±20%
- Electronic Component
- 0.084g
- Inductor
- 470nH
- Electronic Component
- 1
- Electronic Component
- BM0265018963
- Current
- 7.5A
- Resistor(DCR)
- 14mΩ
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- and Current(Isat)
- 8.6A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FTC322512SR47MBCA 产品概述
一、产品简介
FTC322512SR47MBCA 是长江微电（cjiang）推出的一款功率电感，额定应用于中小功率开关电源与电源滤波器。器件为SMD封装，外形尺寸2.5×3.2 mm，针对高电流、低损耗场合优化设计，兼顾体积与热性能，适合现代移动、通信与工业类电源模块使用。
二、主要电气参数
- 电感值：470 nH，公差 ±20%
- 额定电流：7.5 A（连续允许电流）
- 饱和电流（Isat）：8.6 A（在高直流偏置下电感显著下降时的标称值，具体判定请参考厂方规格书）
- 直流电阻（DCR）：约 14 mΩ
- 封装：SMD，尺寸 2.5×3.2 mm
以上参数均以厂方测量方法为准，实际应用中受温度、频率与PCB布局影响。
三、性能特点
- 低DCR：约14 mΩ 的直流电阻有助于降低铜损，提高转换效率，适合高效率同步降压、升压电路。
- 高电流能力：7.5 A 的额定电流与 8.6 A 的饱和电流保证在较大负载下仍能维持稳定磁性能，适用于输出电感或输入滤波。
- 小封装高功率密度：2.5×3.2 mm 的SMD体积便于缩小解决方案尺寸，同时利于自动贴装与回流焊工艺。
- 良好温升控制：针对功率应用的设计可在有限空间内实现较低温升（具体热性能请参考厂方温升曲线）。
四、典型应用场景
- 开关稳压器（降压、升压及其同步拓扑）输出或输入滤波电感
- 电源模块、DC-DC转换器、电源管理单元（PMU）
- 通信设备、边缘计算、便携式设备及工业控制中的高电流滤波与储能
- EMI抑制滤波器与电源去耦
五、封装与安装建议
- PCB布局：电感两端应尽量缩短走线，增加铜面积或采用多过孔散热以降低寄生阻抗与热阻。
- 焊接工艺：支持标准回流焊（请遵循厂方的回流曲线与焊盘建议）。
- 热管理：在高持续电流工况下建议留足铜箔散热区并避免与发热元件紧贴，以保持电感性能与寿命。
- 机械应力：贴片后避免强力挤压或弯曲，焊盘设计应符合厂家给出的焊盘模板以保证焊点可靠性。
六、选型建议与可靠性
- 电流留裕：建议在设计中考虑额定电流的70%~85%作为长期工作电流，以降低磁饱和与温升风险。
- 饱和余量：若电路在瞬态或启动时有较大电流冲击，应预留足够的Isat余量，避免电感值显著下降影响环路稳定。
- 验证测试：在目标频率、温度与实际PCB布局下做电感值随直流偏置与温度的测量，确认符合系统需求。
- 合规与可得性：FTC322512SR47MBCA 为长江微电产品，常见于符合RoHS的工业供应链，具体供货与认证信息请参阅厂商数据手册或联系当地代理。
如需更详细的电感-电流曲线、热阻/温升数据或推荐焊盘尺寸，我可以根据厂方规格书为您整理关键参数与PCB封装建议。
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