WMSIC Electronic Components

cjiang FNR3012S4R7MT

ModelFNR3012S4R7MT
PackageSMD,3x3mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FNR3012S4R7MT
Type
CJIANG
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FNR3012S4R7MT
Electronic Component
1
Package
SMD,3x3mm
Type
Magnetic Display Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.068g
Inductor
4.7uH
Electronic Component
1
Electronic Component
BM0233317975
Current
1.3A
Resistor(DCR)
156mΩ
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FNR3012S4R7MT 产品概述

一、产品简介

FNR3012S4R7MT 是长江微电(cjiang)推出的一款表面贴装磁胶屏蔽功率电感,封装为 3.0 x 3.0 mm(SMD)。标称电感值 4.7 µH,公差 ±20%,面向中低功率开关电源与电磁兼容要求较高的便携式应用场景。

二、主要电气参数

  • 电感值:4.7 µH(±20%)
  • 额定电流:1.3 A(额定热电流,指在允许温升条件下的连续负载能力)
  • 饱和电流 Isat:1.0 A(接近或超过该电流时电感量将明显下降)
  • 直流电阻 DCR:156 mΩ(影响导通损耗与转换效率)
  • 类型:磁胶屏蔽结构,抑制磁通外泄,利于 EMI 控制

举例损耗计算:在 1.0 A 下的铜损约为 I²·R = 1.0²×0.156 ≈ 0.156 W;在额定 1.3 A 下铜损约为 1.3²×0.156 ≈ 0.264 W,需要结合散热条件评估系统温升。

三、结构与特性

磁胶屏蔽结构兼顾磁通封闭与机械稳固,减少对周围器件的磁干扰并提升外部抗扰性。3×3mm 的紧凑封装适合高密度贴装板设计,支持标准回流焊工艺,适配自动化生产线。

四、典型应用场景

  • 移动设备、平板、笔记本等便携式电源模块
  • DC-DC 降压转换器、PMIC 前端滤波与储能元件
  • LED 驱动、摄像模组电源滤波
  • 电池管理与便携式充电器、物联网终端电源部分

五、选型与使用建议

  • 注意 Isat 与额定电流的区别:若工作电流接近或超过 Isat,会导致电感值下降,从而影响输出纹波与稳压性能,建议在设计中对峰值与纹波电流进行降额留有裕量。
  • DCR 对效率影响显著,若对效率要求高,应在系统热设计和电流环路中考虑功耗分布与散热方式。
  • ±20% 的容差适用于对电感精度要求不敏感的电源滤波和储能场景;若对稳定性要求更高,可考虑容差更窄的型号或在电路中增加补偿。
  • 推荐在 PCB 布局时靠近开关元件放置,并保证输入/输出回流路径短而粗,以降低 EMI 与寄生电感。

六、包装与采购

产品型号:FNR3012S4R7MT,品牌:cjiang(长江微电)。SMD 卷带或托盘包装,适合自动贴装与回流焊流程。采购或样品评估时,请向供应商确认最新的器件数据手册、温度特性及可靠性认证资料以便完成最终设计验证。

如需基于该型号的电路建议(例如开关电源拓扑下的电感选型、纹波电流估算与热评估),可提供工作条件信息以便给出更具体的设计指导。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.