WMSIC Electronic Components

cjiang FTC322510S100MBCA

ModelFTC322510S100MBCA
PackageSMD,2.5x3.2mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FTC322510S100MBCA
Type
CJIANG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FTC322510S100MBCA
Electronic Component
1
Package
SMD,2.5x3.2mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.074g
Inductor
10uH
Electronic Component
1
Electronic Component
BM0264532923
Current
2.2A
Resistor(DCR)
365mΩ
Electronic Component
Electronic Component
Electronic Component
3000
and Current(Isat)
2.2A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FTC322510S100MBCA 产品概述

一、产品简介

FTC322510S100MBCA 是长江微电(cjiang)推出的一款小型功率贴片电感,封装尺寸为 2.5×3.2mm,标称电感值 10µH,公差 ±20%。该器件针对空间受限的电源与滤波应用设计,具有额定电流 2.2A(额定电流与饱和电流均为 2.2A),直流电阻(DCR)为 365mΩ,适用于中低功率、对体积要求高的消费类电子与工业电子产品。

二、主要参数

  • 型号:FTC322510S100MBCA
  • 品牌:cjiang(长江微电)
  • 电感值:10µH ±20%
  • 额定电流(Irated):2.2A
  • 饱和电流(Isat):2.2A(具体定义请参照厂方规格书)
  • 直流电阻(DCR):365mΩ
  • 封装:SMD,尺寸 2.5×3.2mm

三、产品特点

  • 小型化:2.5×3.2mm 表面贴装封装,适合高密度 PCB 布局。
  • 适用电流范围明确:2.2A 的额定/饱和电流适合中小电源回路与滤波场合。
  • 可靠性:符合常见 SMT 回流焊工艺要求,便于自动化贴装生产。
  • 成本与性能平衡:较高的 DCR 反映在一定的功耗,但在需要高阻抗或滤波而不以最低损耗为首要目标的场合仍具优势。

四、典型应用场景

  • 移动设备、可穿戴设备的电源滤波与能量传输(对体积敏感、工作电流在额定范围内)。
  • DC-DC 降压/升压模块的输出滤波(适合中低效率或对体积优先的设计)。
  • EMI 滤波器、信号线与电源线的共模/差模抑制(配合其他器件使用)。
  • 工业控制、物联网终端的局部电源滤波。

五、设计与使用建议

  • 功率损耗估算:P = I^2×DCR。举例:在 1A 时约 0.365W;在满载 2.2A 时约 1.77W,功耗与温升不容忽视,设计时应考虑热管理与散热路径。
  • 额定/饱和电流说明:Isat = 2.2A 表示该电流下电感可能接近磁芯饱和,实际使用中建议适当留有裕量以避免大幅降感。
  • 降额使用:为保证长期可靠性与可接受的温升,建议连续工作电流按 70%–80% 的裕量降额。
  • 焊接与封装:兼容无铅回流工艺,建议按厂方推荐回流曲线与 PCB 焊盘布局设计,避免过度机械应力。
  • PCB 布局:靠近开关器件合理布线,增加散热铜箔及必要时开孔/热盲孔帮助散热;地线与电源回路短而粗以降低寄生阻抗。

六、采购与可靠性

  • 建议向授权分销或厂方直接采购,获取最新规格书、SOP 与可靠性测试报告。
  • 在样品验证阶段,进行温升、输出纹波、瞬态响应及长期老化测试,确认在目标应用下的表现满足设计需求。

如需更详细的电气特性曲线、尺寸图或推荐焊盘(PCB footprint)、回流曲线与可靠性报告,可联系厂方或提供具体应用场景,我可以协助整理更精细的设计指导。

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