WMSIC Electronic Components

cjiang FNTC0603X103D3435EA

ModelFNTC0603X103D3435EA
Package0603
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FNTC0603X103D3435EA
Type
CJIANG
Minimum package
4000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FNTC0603X103D3435EA
Electronic Component
1
Electronic Component
0.8mm
Package
0603
Electronic Component
NTCThermistor Resistor
Electronic Component
0.036g
Electronic Component
1.6mm
Electronic Component
10kΩ
Electronic Component
0.8mm
Electronic Component
1
B
±0.7%
Electronic Component
BM0264590595
Operating Temperature
40℃~+125℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FNTC0603X103D3435EA 产品概述

一、产品简介

FNTC0603X103D3435EA 是长江微电(cjiang)推出的一款高精度表面贴装热敏电阻(NTC),封装尺寸为 0603(1.6 × 0.8 × 0.8 mm)。该器件以 10 kΩ(25℃)为标称阻值,具有极高的阻值和 B 值精度,适用于需要体积小、精度高的温度检测与控制场合。

主要参数一览:

  • 标称阻值:10 kΩ(25℃)
  • 阻值公差:±0.5%
  • B 值(25℃/50℃):3380 K
  • B 值(25℃/85℃):3435 K
  • B 值精度:±0.7%
  • 额定功率:100 mW
  • 最大稳态电流(25℃):310 µA
  • 热耗散系数:1 mW/℃(self‑dissipation)
  • 热时间常数:5 s
  • 工作温度范围:-40 ℃ ~ +125 ℃
  • 封装尺寸:0603(1.6 × 0.8 × 0.8 mm)
  • 品牌:cjiang(长江微电)

二、性能特点

  • 高精度阻值与 B 值:阻值公差 ±0.5%、B 值公差 ±0.7%,确保温度测量的重复性与一致性,适合对精度要求较高的温度传感应用。
  • 小体积 SMD 封装:0603 小尺寸,便于在空间受限的 PCB 板上布置,适合移动设备、便携仪器与消费电子。
  • 宽温度范围与稳定性:-40 ℃ 至 +125 ℃ 的工作范围满足绝大多数工业与民用场景的温度测量需求。
  • 快速热响应:热时间常数 5 s,在多数动态温度测量场景中能提供及时的温度响应。
  • 低自热效应:热耗散系数 1 mW/℃,便于评估并控制自加热带来的测量误差。

三、电气与热学说明

  • 最大稳态电流:在 25 ℃ 下器件最大稳态电流为 310 µA,对应的最大允许电压约为 3.1 V(Umax ≈ Imax × R25 = 0.00031 A × 10 000 Ω),超出该电流会引起较大的自热,影响测量精度或损伤器件。
  • 自热与功率:器件额定功率为 100 mW,但在温度测量场合通常受限于自热带来的误差。根据热耗散系数,施加功率 P 会导致近似温升 ΔT = P / (1 mW/℃)。举例:施加 1 mW 功率引起约 1 ℃ 的自热。为保证测量精度,建议在测温应用中使用远低于 1 mW 的偏置功率。
  • 温度响应:热时间常数约为 5 s,表示当环境温度发生阶跃变化时,器件温度在约 5 s 内达到 63% 的稳态变化值。该特性利于快速响应的测温场合,但在需要非常快响应(亚秒级)的应用中需注意滞后。

四、典型应用场景

  • 电池管理系统(BMS):用于电芯或模组温度监测,空间受限且需要高精度的场景。
  • 消费电子与可穿戴设备:如智能手环、便携式仪器的温度采集点。
  • 工业控制与家电:空调、冰箱、热水器等对温度控制有精度要求的产品。
  • 医疗和实验设备:对温度读数稳定性与重复性需求较高的检测点。
  • HVAC、环境监测与物联网终端:体积小、易于贴装,适合集成到传感节点。

五、封装与安装建议

  • 封装信息:0603(1.6 × 0.8 × 0.8 mm)标准贴片封装,兼容常见 SMT 贴装工艺。
  • 焊接工艺:建议采用标准回流焊工艺,遵循无铅或含铅回流曲线规范,避免长时间高温停留以保证长期稳定性。
  • 布线建议:为减小热量传导到邻近元件或 PCB 引起的误差,建议将热敏电阻独立在温测区域,并避免贴近大功率发热器件;在测量点附近保持空气对流以减小局部热积累。
  • 校准与测量:若对绝对温度精度有严格要求,建议在终端应用中做一次系统标定(使用几点法或查表法),利用器件高精度的阻值与 B 值特性获取更准确的温度转换关系。

六、选型与使用注意

  • 若系统允许,尽量使用低测量电流(例如 5–50 µA)以降低自热误差并提升测量稳定性。
  • 在需要长期稳定性的设计中,注意避免超过最大稳态电流与长期高温暴露,以延长器件寿命并保持阻值精度。
  • 结合器件 B 值(25/50 与 25/85)可选取适合的温度计算算法(指数公式或查表插值)以获得最优测温精度。
  • 如需批量采购或获得更多技术资料(如阻温曲线、封装尺寸图、回流焊曲线),请联系长江微电(cjiang)或其授权分销商获取完整的产品数据手册与质量文件。

FNTC0603X103D3435EA 以其高精度、微小封装和良好的热电性能,适合在多种精密温度检测场合替代传统大型传感器,实现更高密度的系统布局与更可靠的温度控制。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.