WMSIC Electronic Components

cjiang FXL0530-1R2-M FXL0530

ModelFXL0530-1R2-M
PackageSMD
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FXL0530-1R2-M
Type
SMD
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FXL0530-1R2-M
Electronic Component
1
Package
SMD
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.555g
Inductor
1.2uH
Electronic Component
1
Electronic Component
BM0258614547
Current
8.5A
Resistor(DCR)
16mΩ
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FXL0530-1R2-M 产品概述

一、产品简介

FXL0530-1R2-M 是长江微电(cjiang)推出的一款一体成型功率电感,额定电流高、直流电阻低,专为开关电源、电源管理模块等高电流场景设计。标称电感值为 1.2 μH,公差 ±20%,外形为表面贴装(SMD),外形尺寸约 5.2×5.4 mm,适合集成度要求高的应用环境。

二、主要特性

  • 电感值:1.2 μH ±20%
  • 额定电流(Ir):8.5 A(长期允许通过的电流,参考生产商数据)
  • 饱和电流(Isat):11 A(电感下降至初始值一定比例时的电流)
  • 直流电阻(DCR):约 16 mΩ,损耗小、效率高
  • 类型:一体成型功率电感,SMD 封装,便于自动贴装与回流焊工艺

三、电气参数与性能说明

  • 额定电流与饱和电流:额定电流表示连续工作下不会导致温升或参数超限的电流值;饱和电流为 L 值明显下降的临界值,设计时应保证工作中的电流峰值低于 Isat 以避免电感失效或性能退化。
  • DCR 与发热:16 mΩ 的低 DCR 有利于降低铜损和温升,但在高脉冲电流场合仍需评估平均功耗与散热条件。
  • 频率响应:典型功率电感在开关频率(几百 kHz 至几 MHz)下仍能保持较好性能,具体阻抗随频率上升,请参照曲线数据评估纹波抑制能力。

四、封装与机械特性

  • 封装形式:SMD 一体成型,适合自动化贴装与回流焊;外形尺寸 5.2×5.4 mm,适配紧凑型电路板布局。
  • 可靠性:封装防护良好,适合振动、电磁干扰较大的环境;具体耐温、耐湿与寿命应参考厂家规范或样片测试结果。

五、典型应用

  • 同步降压/升压 DC-DC 转换器(点式电源)
  • 电源管理模块、服务器与通信设备电源滤波与储能
  • 工业控制、电机驱动电源子模块(需结合温升与可靠性评估)
  • 消费电子高电流轨供电

六、选型与使用建议

  1. 峰值电流规划:确保峰值电流小于 Isat,且连续电流不超过额定 8.5 A,必要时留有裕量以延长寿命与防止参数漂移。
  2. 损耗评估:根据 DCR 计算铜损并考虑散热路径,必要时在布局上增加散热铜箔或散热器。
  3. EMI 与布局:将电感靠近开关器件布置,优化回流电流路径,减小走线环路面积以降低辐射与噪声。
  4. 回流焊注意事项:遵循厂方推荐的焊接温度曲线,避免过高回流峰值温度或长时间高温,影响性能与寿命。

七、包装与支持

  • 常见为卷盘包装(适配 SMT 贴片线),具体包装规格和批量可咨询供应商。
  • 在批量导入前建议做样机测试,包含温升、效率、EMI、寿命与焊接兼容性验证。

FXL0530-1R2-M 以高电流能力、低 DCR 和紧凑封装为特点,适合需要高效率与高集成度的电源设计场景。选择时请结合系统电流峰值、热设计与可靠性要求做综合评估,必要时联系厂方获取详细的电气特性曲线与应用资料。

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