WMSIC Electronic Components

cjiang FNR3015S3R9MT

ModelFNR3015S3R9MT
PackageSMD
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FNR3015S3R9MT
Type
CJIANG
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FNR3015S3R9MT
Electronic Component
1
Package
SMD
Type
Magnetic Display Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.075g
Inductor
3.9uH
Electronic Component
1
Electronic Component
BM0258614537
Current
1.5A
Resistor(DCR)
137mΩ
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FNR3015S3R9MT 产品概述

FNR3015S3R9MT 是长江微电(cjiang)推出的一款小型磁胶屏蔽贴片电感器,额定电感值为 3.9 μH,主要面向空间受限且对电磁兼容有一定要求的电源滤波与能量传输场合。器件采用 SMD 封装,便于自动贴装与大批量生产。

一、主要参数

  • 电感值:3.9 μH(标称)
  • 公差:±20%(标称范围约 3.12 μH ~ 4.68 μH)
  • 额定电流:1.5 A(连续工作建议以内)
  • 饱和电流(Isat):1.4 A(在该电流附近电感量将显著下降)
  • 直流电阻(DCR):约 137 mΩ
  • 类型:磁胶屏蔽电感(屏蔽结构,有助于减小磁通外逸)
  • 封装:SMD,适合表面贴装工艺

二、结构与屏蔽特性

该器件采用磁性材料与胶封结构实现屏蔽效果,能有效抑制磁辐射与相互干扰,适用于高密度电路板布局。磁胶屏蔽结构在保证感值稳定性的同时,提升了抗外界扰动能力,利于满足 EMI 要求较高的设计。

三、电气性能与热耗分析

  • 由于 DCR 为 137 mΩ,器件在额定电流 1.5 A 下的铜损约为 I^2·R ≈ 0.31 W(近似值),需在热预算中考虑此发热并留有余量。
  • 饱和电流 1.4 A 表明当电路中的峰值或直流偏置接近或超过该值时,感值会明显下降,应避免长期工作在饱和区。
  • 公差 ±20% 意味着在设计滤波或谐振电路时需考虑感值偏差带来的影响。

四、典型应用场景

  • 开关电源(尤其是小电流降压/升压转换器)
  • 电源滤波与输入/输出去耦(点对点电源滤波)
  • 移动设备、手持终端、物联网终端等对体积和 EMI 有要求的产品
  • 模拟/数字电路的共模/差模噪声抑制(视具体拓扑而定)

五、选型与注意事项

  • 若电路有瞬态峰值电流(例如开关管电流峰值),应确保峰值显著低于 Isat,建议留 20%~30% 的裕量。
  • 对热敏感或高环境温度场合,应考虑 DCR 随温度上升导致的额外损耗与温升。
  • 在对电感精度要求较高的滤波或谐振场合,±20% 的公差可能需使用更高精度器件或在电路中留可调余地。
  • 若对 EMI 要求特别严格,仍需在系统级做验证,因为屏蔽并不能替代合理的布局与走线设计。

六、PCB 布局与使用建议

  • 电感应尽量靠近负载或开关器件放置,缩短关键回路的走线,减小环路面积以降低干扰。
  • 输入/输出滤波电容宜与电感形成紧密耦合,电容铺设应尽可能靠近电感脚位。
  • 留出足够的散热路径(铜箔面积或热铜垫),并在必要时使用过孔增加散热能力。
  • 避免在电感正上方放置高灵敏度的模拟元件或天线,以减少互扰。

七、可靠性与环境适应

磁胶屏蔽结构对机械振动和冲击有一定的缓冲作用,适合常规工业与消费电子环境。具体的温度范围、焊接耐受性与生命周期需参考厂方完整数据手册与可靠性测试报告。表面贴装器件须遵循厂商给出的回流焊曲线以保证焊接可靠性。

八、采购与替代建议

FNR3015S3R9MT 适用于对体积、屏蔽与中等电流要求的通用电源滤波场合。选型时若需要更高电流能力或更小 DCR,可考虑同系列更大尺寸或采用不同磁芯材料的型号;若需更高精度则考虑公差更小的型号。具体订购、最小包装数量与可得性请联系长江微电(cjiang)或其授权分销商获取最新信息。

总结:FNR3015S3R9MT 在小体积屏蔽化设计中兼顾电磁兼容与中等电流能力,适合便携与空间受限的电源滤波应用。但在有较大脉冲电流或对精度、发热有严格要求的场合,需在选型阶段进行额外验证与裕量设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.