WMSIC Electronic Components

cjiang FWP252010P-R47ML FWP252010P

ModelFWP252010P-R47ML
PackageSMD-2P,2.5x2mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FWP252010P-R47ML
Type
CJIANG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FWP252010P-R47ML
Electronic Component
1
Package
SMD-2P,2.5x2mm
Type
Magnetic Display Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.05g
Inductor
470nH
Electronic Component
1
Electronic Component
BM0264590606
Current
3.9A
Resistor(DCR)
27mΩ
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FWP252010P-R47ML 产品概述

一、产品简介

FWP252010P-R47ML 是长江微电(cjiang)推出的一款功率屏蔽型贴片电感,标称电感值 470 nH,公差 ±20%,额定电流 3.9 A,饱和电流(Isat)5 A,直流电阻 (DCR) 约 27 mΩ。器件采用磁胶屏蔽结构(磁性胶体封装),封装形式 SMD-2P,外形尺寸 2.5 × 2.0 mm(常见尺寸 1008 尺寸等级),专为高密度、 高频开关电源与功率管理应用优化。

二、主要特性与优势

  • 小体积、高电流:2.5×2.0 mm 紧凑外形,额定电流达 3.9 A,适合空间受限的电源模块与 PoL(point-of-load)应用。
  • 低 DCR:约 27 mΩ 的直流电阻有助于降低铜损,提高转换效率。
  • 高饱和电流:5 A 的饱和电流裕量可应对瞬态冲击与峰值电流,降低磁饱和导致的性能退化风险。
  • 屏蔽结构:磁胶屏蔽设计减小磁通泄露,利于 EMI 控制与邻近器件干扰抑制。
  • 封装与工艺兼容:标准 SMD 封装,适配自动贴装与回流焊工艺,便于批量生产。

三、典型应用场景

  • DC-DC 降压/升压转换器(尤其是高频同步整流拓扑)
  • 模块化电源、PoL 电源、供电管理芯片旁路与能量储存元件
  • 移动设备、通信设备、工业电源和部分消费电子的电源滤波与储能
  • LED 驱动、FPGA/CPU 供电回路中对瞬态响应有要求的电感元件

四、选型与设计注意事项

  • 额定电流与温升:额定 3.9 A 通常以一定温升边界(如 40–50°C)下定义,实际应用中建议按电路允许的温升与可靠性余量进行电流降额(如 80–90%)。
  • 饱和与直流偏置:高直流偏置情形会导致电感值下降,需考虑工作点(DC bias)对 470 nH 值的影响,保证在最大工作电流下仍满足滤波/储能要求。
  • 损耗与效率:DCR 为效率设计的重要参数,需与拓扑、开关频率及纹波电流共同评估整体损耗。
  • EMI 管理:虽然屏蔽结构有利于降低磁场泄露,但布局时仍应将电感靠近开关器件并配合电容、地平面优化回流路径。

五、封装与焊接建议

  • 回流焊:器件兼容无铅回流工艺,推荐遵循 JEDEC 标准回流曲线进行焊接,避免长时间高温暴露以保护粘合材料。
  • 安装布局:尽量将电感放置于开关器件近旁以缩短环路长度;留意器件间距和散热条件,保证良好热传导与散热。
  • 机械应力:贴片器件对剪切和机械冲击敏感,贴装与后处理过程中避免强烈振动或弯曲底板。
  • 清洗与维护:若需清洗,采用对磁性粘结材料兼容的工艺;清洗后确保无残留物影响电气性能。

六、可靠性与测试建议

在量产前建议进行样件验证,包括但不限于:焊接可靠性(热循环、湿热)、电气特性(DCR、L值、Isat)、温升测试及长期功率循环测试,以验证在目标应用中的可靠性与寿命表现。

总结:FWP252010P-R47ML 以小尺寸、较高额定电流与低 DCR 为特点,适合高频开关电源与空间受限场合的功率电感需求。选型时需结合实际电流、温升与 DC bias 特性综合评估,以获得最佳的性能与可靠性表现。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.