WMSIC Electronic Components

cjiang FXL0630-R33-M FXL0630

ModelFXL0630-R33-M
PackageSMD
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FXL0630-R33-M
Type
CJIANG
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FXL0630-R33-M
Electronic Component
1
Package
SMD
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.84g
Inductor
330nH
Electronic Component
1
Electronic Component
BM0264590572
Current
21A
Resistor(DCR)
3.5mΩ
Electronic Component
Electronic Component
Electronic Component
1500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FXL0630-R33-M 产品概述

一、主要特性

FXL0630-R33-M 是长江微电(cjiang)推出的一体成型功率电感,标称电感值 330nH(±20%),面向高电流开关电源场景。该器件额定电流 21A,饱和电流(Isat)25A,直流电阻仅 3.5mΩ,封装为 SMD,外形尺寸约 6.6 × 7.0 mm。集成化模具封装提高了机械强度和可靠性,适合高功率密度应用。

二、典型电气参数

  • 电感值:330 nH ±20%
  • 额定电流(Irms):21 A
  • 饱和电流(Isat):25 A(电感下降至标称值一定比例时的参考)
  • 直流电阻(DCR):约 3.5 mΩ(低 DCR 有利于降低铜损)
    这些参数表明该器件在中低电感值但高电流和低损耗场合表现优秀。

三、结构与封装

FXL0630-R33-M 采用一体成型(molded)工艺,SMD 贴片封装,尺寸 6.6×7 mm,便于自动贴装与回流焊工艺。模封结构有利于防潮、抗振动以及长期工作稳定性,适合工业及车规级盒装使用(具体环境等级请参照原厂数据表)。

四、典型应用

  • 同步降压(Buck)和升降压(Buck-Boost)电源的能量储存元件
  • CPU/GPU/FPGA 的电压调节模块(VRM)
  • 高亮 LED 驱动、通信电源、车载电子电源及工业电源等对效率和电流要求较高的场合

五、设计与使用建议

  • 考虑直流偏置效应:在高直流电流下电感值会下降,应根据工作电流查阅或测试电感随电流的变化曲线以避免进入饱和区。
  • 散热与温升:在接近额定电流工作时注意温升,合理布板、加大铜厚或使用散热过孔以降低温度上升。
  • 布局:输入输出电容应靠近电感两端布局,走线尽量短且宽,减小寄生阻抗与 EMI。
  • 焊接:支持无铅回流焊工艺,焊接温度与曲线按厂家推荐执行以保证可靠性。
  • 测试:在实际应用中应测量纹波电流下的温升与效率,验证长期稳定性。

六、选型要点与可靠性

选型时关注电感随电流的可用电感量、DCR 对效率的影响以及饱和余量(Isat 与实际峰值电流)。一体成型封装提高了抗振和湿气性能,适合长期运行。关键参数和环境适配(如工作温度、过载能力)建议以厂家原始数据表为准。

七、订购信息

型号:FXL0630-R33-M
品牌:cjiang(长江微电)
封装:SMD,常见卷带(Tape & Reel)包装。
如需批量采购或获取数据手册、纹波/温升曲线和封装图,建议联系供应商或访问厂方资料以获取完整技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.