WMSIC Electronic Components

cjiang FNR3012S2R2NT

ModelFNR3012S2R2NT
PackageSMD
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FNR3012S2R2NT
Type
CJIANG
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FNR3012S2R2NT
Electronic Component
1
Package
SMD
Type
Magnetic Display Inductor
Electronic Component
Power Inductor
Electronic Component
±30%
Electronic Component
0.067g
Inductor
2.2uH
Electronic Component
1
Electronic Component
BM0265018918
Current
1.7A
Resistor(DCR)
98mΩ
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FNR3012S2R2NT 产品概述

一、概述

FNR3012S2R2NT 是长江微电(cjiang)推出的一款磁胶屏蔽功率电感,额定工作电流 1.7A,饱和电流(Isat)1.9A,标称电感值 2.2µH(公差 ±30%),片式 SMD 封装,外形约 3×3 mm,直流电阻(DCR)约 98 mΩ。该器件以小体积、高电流承载能力和良好电磁屏蔽性能为特点,适合用于空间受限的开关电源和电源滤波场合。

二、主要参数(关键项)

  • 电感值:2.2 µH ±30%
  • 额定电流:1.7 A(连续)
  • 饱和电流 Isat:1.9 A(通常按电感值下降约 30% 定义)
  • 直流电阻 DCR:约 98 mΩ
  • 封装形式:SMD,3 × 3 mm 级别
  • 类型:磁胶(磁性胶体)屏蔽电感(低外泄磁场,利于 EMI 控制)

三、性能与特性

  • 小型化:3×3 mm 级别封装,便于高密度 PCB 布局。
  • 高电流能力:1.7A 额定电流可满足中小功率降压转换器和输入滤波需求。
  • 屏蔽设计:磁胶屏蔽减少磁通外溢,降低对周边敏感电路的干扰。
  • 宽松公差:±30% 适用于非精密滤波或成本敏感型电源设计。
  • 损耗评估:在额定电流 1.7A 下,铜损约为 P = I^2·R ≈ 0.283 W(供热设计参考)。

四、应用场景

  • 移动设备、便携仪器的降压(Buck)转换器输入/输出滤波。
  • 嵌入式主板、网络设备和通信终端的电源管理模块。
  • 对体积与成本有严格要求且对电感精度要求不高的开关电源系统。
  • EMI 要求较高场合的局部屏蔽滤波解决方案。

五、设计与使用建议

  • 电流裕量:为避免磁饱和与过高温升,设计时推荐留有一定裕量,长期工作电流优先以额定电流以下为宜;高温环境下需进一步降额。
  • 饱和处理:当工作电流接近或超过 Isat(1.9A)时,电感值将明显下降,应避免长期工作在饱和区。
  • 损耗与热管理:考虑 DCR 带来的 I^2R 损耗,若连续损耗接近或超过数百毫瓦,应在 PCB 布局和散热上预留空间。
  • 布局要点:电感应靠近开关器件布置,输入/输出旁路电容要短距离连接以降低回路电感。屏蔽型设计有助于减小辐射噪声,但仍需注意敏感器件的距离。

六、工艺与可靠性

  • 适配无铅回流焊常规工艺(建议遵循 IC 制造商/PCB 工艺规范的回流温度曲线)。
  • 存储与处理:避免潮湿环境,装配前若器件经受潮湿需按回流前烘烤要求处理。
  • 质量检验:常规量检包括电感值测试、DCR 测试及高温老化、振动与焊接可靠性验证。

七、选型提示

  • 若需要更高精度或更低 DCR,请选用公差更小或更大截面积线圈的型号。
  • 若工作电流接近或超过 1.9A,应考虑饱和电流更高的替代品以保证电感稳定性。
  • 对 EMI 要求极高的设计,可同时配合屏蔽罩或差分布局进一步优化。

备注:本文基于器件的关键参数给出工程使用建议,实际应用应结合样片测试和系统级验证确定最终方案。若需封装尺寸图、频率特性曲线或样片采购信息,可联系供应商获取详细资料。

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