WMSIC Electronic Components

cjiang FXL0615-100-M FXL0615

ModelFXL0615-100-M
PackageSMD,6.6x7.0mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FXL0615-100-M
Type
CJIANG
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FXL0615-100-M
Electronic Component
1
Package
SMD,6.6x7.0mm
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.513g
Inductor
10uH
Electronic Component
1
Electronic Component
BM0264900089
Current
2A
Resistor(DCR)
175mΩ
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FXL0615-100-M 一体成型功率电感产品概述

FXL0615-100-M是长江微电(cjiang)推出的一款小型化、高可靠性一体成型功率电感,专为中低功率电源电路的储能、滤波及EMI抑制设计,凭借紧凑封装与稳定电气性能,广泛适配消费电子、工业控制等多领域应用。

一、产品核心定位与工艺优势

作为长江微电功率电感产品线的经典型号,FXL0615-100-M聚焦高密度PCB设计+高可靠性需求,核心优势体现在:

  1. 一体成型工艺:采用磁粉芯与线圈一体化压制,无裸露线圈结构,显著降低电磁辐射(EMI),同时提升机械强度,可承受10G以上振动测试,适配工业、汽车等恶劣环境;
  2. 电流承载平衡:额定连续电流(Irms)2A满足常规电源稳定工作,饱和电流(Isat)3A覆盖瞬态过载需求,避免电路失效;
  3. 紧凑封装适配:6.6×7.0mm SMD贴片封装,兼容自动贴装设备,节省PCB空间,完美匹配小型化产品(如智能手机、LED驱动模块);
  4. 品牌品质保障:长江微电长期深耕功率电感领域,产品一致性好,批次差异小,符合主流电源设计规范。

二、关键电气参数解析

FXL0615-100-M的电气参数经过优化,满足多场景电源设计需求,核心参数及设计意义如下:

参数项 规格值 设计意义 电感值 10uH±20% 覆盖DC-DC降压/升压电路的储能需求,精度满足常规电源滤波设计 额定电流(Irms) 2A 连续工作时电感温升≤40K(行业常规标准),保证长期可靠性,无过热风险 饱和电流(Isat) 3A 电流达3A时电感值下降≤30%(行业测试标准),评估瞬态过载能力,避免性能突变 直流电阻(DCR) 175mΩ 低DCR降低导通损耗,提升电源效率(如12V转5V电路中,损耗≤0.7W@2A) 封装尺寸 6.6×7.0mm SMD 贴片封装,兼容主流回流焊工艺,适配高密度PCB布局

三、物理封装与工艺特性

  1. 封装结构:采用标准SMD贴片封装,长6.6mm、宽7.0mm,引脚间距符合IEC 60068-2-6振动测试规范,可直接集成到常规PCB板;
  2. 磁芯材料:选用高性能铁硅铝磁粉芯,兼顾高饱和磁通密度(Bsat≥1.0T)与低损耗,减少高频工作时的磁芯发热;
  3. 线圈设计:采用高导电率无氧铜线绕制,线圈匝数优化匹配10uH电感值,确保低DCR与高电流承载能力;
  4. 防护性能:一体成型结构无缝隙,可有效防止灰尘、湿气侵入,提升产品耐候性。

四、典型应用场景

FXL0615-100-M的参数与封装特性,使其适配以下主流应用:

  1. 消费电子电源:智能手机、平板电脑、笔记本电脑的CPU/内存降压转换器(如12V转3.3V),满足小型化与效率需求;
  2. LED驱动电路:中功率LED照明(面板灯、台灯)的恒流驱动模块,10uH电感值匹配LED电流纹波控制;
  3. 工业控制电源:小型PLC、传感器模块的电源滤波,抗振动特性适合工厂车间环境;
  4. 通信设备:路由器、交换机的DC-DC电源模块,低EMI特性减少对射频电路的干扰;
  5. 汽车电子辅助电路:车载充电器、仪表盘背光驱动,符合车规级振动与温度要求(-40℃~125℃工作范围)。

五、选型与使用注意事项

为保证产品性能与可靠性,设计与使用需注意以下要点:

  1. 电流匹配:工作电流需≤额定电流2A,瞬态峰值电流≤饱和电流3A,避免电感过热或电感值骤降;
  2. 焊接工艺:采用回流焊,峰值温度控制在230℃~250℃,焊接时间≤30s,禁止手工焊接(易损伤封装);
  3. 散热设计:PCB焊盘需增加敷铜面积(≥10mm²),提升散热效率,避免局部过热;
  4. 环境适配:确认应用场景温度范围(-40℃~125℃),避免在超温环境下工作;
  5. 焊盘匹配:PCB焊盘尺寸需与6.6×7.0mm封装匹配,引脚间距符合0.5mm/0.6mm常规规范。

综上,FXL0615-100-M凭借一体成型工艺、稳定电气性能与紧凑封装,成为中低功率电源电路的优选电感,可满足多领域产品的小型化与可靠性需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.