WMSIC Electronic Components

cjiang FNR6028S101MT

ModelFNR6028S101MT
PackageSMD
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FNR6028S101MT
Type
CJIANG
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FNR6028S101MT
Electronic Component
1
Package
SMD
Type
Magnetic Display Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.525g
Inductor
100uH
Electronic Component
1
Electronic Component
BM0264590524
Current
770mA
Resistor(DCR)
650mΩ
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FNR6028S101MT 产品概述

一、产品简介

FNR6028S101MT 为 cjiang(长江微电)推出的一款功率电感,属于磁胶屏蔽型表面贴装(SMD)器件。器件尺寸紧凑,典型封装 6×6 mm,适合在空间受限的电源应用中提供稳定的储能与滤波功能。标称电感值为 100 μH,公差 ±20%,面向中低功率开关电源与 EMI 滤波场合。

二、主要参数

  • 电感值:100 μH(±20%)
  • 额定电流(Irated):770 mA
  • 饱和电流(Isat):710 mA(在此电流下电感下降到一定比例)
  • 直流电阻(DCR):650 mΩ
  • 类型:磁胶屏蔽电感(屏蔽型,减小磁泄漏)
  • 封装:SMD,6×6 mm
  • 品牌:cjiang(长江微电)

三、产品特性与优势

  • 屏蔽结构:磁胶屏蔽设计降低磁通外泄,便于靠近敏感电路布局,减少互扰。
  • 紧凑尺寸:6×6 mm SMD 形式易于自动贴装,适合高密度 PCB 布局。
  • 中等电流能力:770 mA 额定电流适合中小功率 DC-DC 降压、升压模块及 LED 驱动应用。
  • 可预测功耗:较高的 DCR 带来可控的铜损,便于热设计与可靠性评估。

四、典型电气损耗估算

  • 在额定电流 0.77 A 下,铜损 P = I^2·DCR ≈ 0.77^2 × 0.65 Ω ≈ 0.39 W;
  • 在接近饱和电流 0.71 A 下,P ≈ 0.71^2 × 0.65 Ω ≈ 0.33 W。
    建议电路设计中考虑散热与电感电流的余量,避免长时间工作在接近饱和区。

五、典型应用

  • 开关电源(DC-DC 降压/升压)储能与滤波
  • 输入/输出滤波器(降低开关噪声与纹波)
  • LED 驱动电源与小功率电源模块
  • 工业与消费类电子中对体积与电磁兼容有要求的场合

六、选型与使用建议

  • 电流裕量:为避免电感值显著降低,建议工作电流控制在额定电流的 70%–90% 范围内,关键应用可进一步降低至 60% 左右。
  • 温升与散热:考虑到 DCR 带来的铜损,若长期高负载运行应优化 PCB 走铜与散热路径。
  • 测试条件:在设计验证阶段,应在目标工作频率和电流下实测电感与损耗,确认热压降与电感衰减情况。

七、焊接与储存注意

  • 建议按行业标准回流焊工艺(参考 J-STD-020)进行贴片回流,避免超出推荐温度曲线的多次高温循环。
  • 储存时避免高湿环境,建议密封防潮包装并在规定时间内回流焊接使用。

如需详细电感频率特性、温度系数、焊盘尺寸建议或原理图/封装库文件(CAD/3D),可联系供应商获取完整数据手册和样片测试资料。

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