Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
cjiang FXL0420-R22-M FXL0420
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- cjiang FXL0420-R22-M
- Type
- CJIANG
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJIANG
- Electronic Component
- FXL0420-R22-M
- Electronic Component
- 1
- Package
- SMD
- Type
- Inductor
- Electronic Component
- Power Inductor
- Electronic Component
- ±20%
- Electronic Component
- 0.297g
- Inductor
- 220nH
- Electronic Component
- 1
- Electronic Component
- BM0264590519
- Current
- 9.5A
- Resistor(DCR)
- 6.6mΩ
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FXL0420-R22-M 产品概述
一、概述
FXL0420-R22-M 是长江微电（cjiang）推出的一款一体成型功率电感，封装为 SMD，外型尺寸约 4.2 × 4.4 mm。标称电感值 220 nH（0.22 µH），公差 ±20%，面向需要大电流、高可靠性的开关电源和功率变换场合设计。
二、主要电气参数
- 电感值：220 nH ±20%
- 额定电流（Irms）：9.5 A（连续载流能力）
- 饱和电流（Isat，定义见供应商数据表）：12.5 A（电感降至额定值的指定比例时）
- 直流电阻（DCR）：≈6.6 mΩ（低损耗，有利于提高转换效率）
- 类型：一体成型功率电感（Molded Power Inductor）
- 封装：SMD，尺寸约 4.2 × 4.4 mm
三、产品亮点
- 低 DCR（6.6 mΩ）：降低铜损，适合高效率设计。
- 高饱和电流（12.5 A）：在瞬态或冲击电流下仍能保持较好电感量，减少磁饱和带来的性能下降。
- 小型化封装：单位体积内提供较高电流能力，便于 PCB 布局和高密度电源模块集成。
- 一体成型结构：机械强度高，抗振动、适合自动贴装与回流焊工艺。
四、典型应用场景
- 同步升降压（buck/boost）开关电源（尤其是点对点 PoL VRM）
- 车规与工业电源模块、LED 驱动、USB/PD 电源解决方案
- DC-DC 模块、背光驱动、电池管理系统（BMS）等需要 5–15 A 量级的功率滤波与储能场合
五、PCB 布局与散热建议
- 将电感尽量靠近开关器件（MOSFET 或功率二极管）与电感电流回路，缩短高频回路面积以减少 EMI。
- 使用较宽的铜箔和多层过孔（vias）进行热量和电流分散，减小 DCR 对温升的影响。
- 对于大电流应用，可在电感焊盘下方或周围增加铜箔面积并与散热层相连，以改善热传导。
- 保持输入/输出电容紧邻电感两端，降低环路阻抗与电压尖峰。
六、选型注意事项
- 核实 Isat 的定义与测试条件（通常为电感降至初始值某一比例时的电流），并预留安全裕量避免工作在饱和区。
- 依据系统允许的功耗预算，用 DCR 与额定电流计算铜损（P = I^2·DCR），并评估温升及散热需求。
- 考虑电感公差 ±20% 对工作频率与纹波电流的影响，必要时选择更精确或更高电感量的型号。
- 在高温或长时间高载荷场景下，参考厂商数据表的温度漂移与寿命曲线进行设计裕量。
七、封装与采购
FXL0420-R22-M 为 SMD 封装，适合自动贴装与回流焊；通常以卷带（Tape & Reel）方式提供。具体包装方式、回流曲线与可靠性认证信息，请向长江微电或授权经销商索取最新版数据手册与样品，以便验证实际工艺兼容性与长期可靠性。
如需更详细的频率特性、饱和曲线、温升数据或样品支持，建议直接联系长江微电并索取完整技术资料。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
