WMSIC Electronic Components

cjiang FTC201612S2R2MBCA

ModelFTC201612S2R2MBCA
PackageSMD,1.6x2mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FTC201612S2R2MBCA
Type
CJIANG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FTC201612S2R2MBCA
Electronic Component
1
Package
SMD,1.6x2mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.051g
Inductor
2.2uH
Electronic Component
1
Electronic Component
BM0233301627
Current
3.3A
Resistor(DCR)
90mΩ
Electronic Component
Electronic Component
Electronic Component
3000
and Current(Isat)
3.1A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FTC201612S2R2MBCA 产品概述

一、产品简介

FTC201612S2R2MBCA 是长江微电(cjiang)推出的一款表面贴装功率电感,封装尺寸仅 1.6 × 2.0 mm,标称电感值 2.2 µH,公差 ±20%。该器件针对高密度电源方案设计,适合点载(point-of-load)和多相 DC-DC 转换器等应用场景。

二、主要参数

  • 品牌:cjiang(长江微电)
  • 型号:FTC201612S2R2MBCA
  • 电感值:2.2 µH ±20%
  • 额定电流:3.3 A(连续额定)
  • 饱和电流 Isat:3.1 A(典型定义为电感下降到额定值一定比例时)
  • 直流电阻 DCR:约 90 mΩ
  • 封装:SMD,尺寸 1.6 × 2.0 mm

三、核心特性与设计要点

  • 小型化封装,适合高密度布板与空间受限场合。
  • 较高的额定电流能力(3.3 A),适用于中等功率点的电源滤波与储能。
  • 注意 Isat(3.1 A)与额定电流关系:Isat 表示磁芯在大电流下开始明显饱和、导致电感下降的临界点;当工作电流接近或超过 Isat 时,电感值会显著下降,影响输出纹波与控制环路稳定性。因此建议在实际设计中留有裕量,优先保证峰值与纹波电流低于 Isat 的 70%–80%(视系统容忍度而定)。

四、性能与损耗估算

  • DCR 为 90 mΩ,导通损耗不可忽视。举例:若平均电流 3.0 A,则 I^2·R 约为 0.81 W(仅导通损耗),实际功率损耗受占空比与开关频率影响,应在热设计中考虑。
  • 高频磁损随开关频率上升而增加,推荐在目标频率下验证电感的交流损耗与温升数据。

五、应用建议

  • 典型应用:降压(Buck)转换器、点式浓缩(POL)电源、LED 驱动、消费类与通信设备的电源滤波与储能。
  • 选型建议:若系统峰值电流或负载瞬态可能接近或超过 3 A,应考虑额定电流与饱和电流都更高的型号以保证稳定性。
  • 在电流纹波较大或开关频率较高的场合,优先评估核心损耗与温升。

六、PCB 布局与焊接注意

  • 将电感放置于输入/输出端子附近,尽量缩短输入回路及开关器件之间的回路面积以降低寄生噪声。
  • 使用宽铜箔连接端子以降低串联电阻并帮助散热;必要时在电感下方增加散热铜箔或散热过孔(若 PCB 层允许)。
  • 采用符合无铅回流工艺的焊接曲线;具体回流温度及推荐焊盘尺寸请参照厂方尺寸图与回流规范。

七、可靠性与采购信息

  • 订购型号:FTC201612S2R2MBCA,建议从正规代理或厂家渠道购买以保证质量一致性。
  • 详细环境温度范围、试验条件(如电感测量频率、温升测试方法)、包装形式与合规性(RoHS 等)请参阅厂家数据手册与检验报告。
  • 在量产前建议进行样机验证,包括温升测试、纹波电流下的电感变化及长期可靠性试验。

如需我为您整理厂方数据手册中的典型频率响应曲线、建议焊盘尺寸或在特定电源拓扑中的仿真建议,可提供更具体的电路参数与工作条件,我将进一步协助。

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