WMSIC Electronic Components

cjiang FTC201610S1R5MBCA

ModelFTC201610S1R5MBCA
PackageSMD,1.6x2mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FTC201610S1R5MBCA
Type
CJIANG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FTC201610S1R5MBCA
Electronic Component
1
Package
SMD,1.6x2mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.044g
Inductor
1.5uH
Electronic Component
1
Electronic Component
BM0257252741
Current
2.6A
Resistor(DCR)
80mΩ
Electronic Component
Electronic Component
Electronic Component
3000
and Current(Isat)
3.2A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FTC201610S1R5MBCA 功率电感产品概述

一、产品简介

FTC201610S1R5MBCA(品牌:cjiang/长江微电)是一款表面贴装型功率电感,封装尺寸 1.6 × 2.0 mm,标称电感值 1.5 μH,公差 ±20%。该器件面向中小功率 DC–DC 降压与电源滤波应用,额定电流 2.6 A,饱和电流(Isat)3.2 A,直流电阻(DCR)约 80 mΩ,适合空间受限但需较高电流能力的场合。

二、主要参数(关键数值)

  • 型号:FTC201610S1R5MBCA
  • 品牌:cjiang(长江微电)
  • 电感值:1.5 μH ±20%
  • 额定电流:2.6 A(连续额定)
  • 饱和电流:3.2 A(磁芯饱和点)
  • 直流电阻:≈ 80 mΩ
  • 封装:SMD,外形尺寸 1.6 × 2.0 mm

三、性能亮点

  • 小封装、高电流:在 1.6×2 mm 的体积下仍能提供 ~2.6 A 连续工作能力,适合高密度电源模块。
  • 明确的饱和裕度:Isat = 3.2 A,可容纳短时浪涌或大幅电流摆幅,降低铁芯饱和风险。
  • DCR 指标可直接估算 I^2R 损耗(例如在额定电流下损耗约 0.54 W),便于热设计与散热评估。
  • 标称公差 ±20% 适用于开关电源滤波与能量传输场景,但在精密谐振电路需注意电感容差影响。

四、典型应用场景

  • 手机、平板、便携式设备的降压(Buck)稳压器输出滤波。
  • LED 驱动、便携电源与移动通信模块的电源管理。
  • 工业控制板、车规电子(在满足温升与环境要求时)的小型电源模块。
  • 输入滤波与去耦:在空间受限且需要较高饱和裕度的场合优先考虑。

五、选型与使用建议

  • 额定电流与饱和裕度:设计时应保证工作电流(含纹波峰值)低于额定电流 2.6 A 为佳,短时浪涌不超过 Isat(3.2 A)。为可靠性建议连续工作电流按 70–80% 进行适度降额。
  • 损耗与温升:DCR 为 80 mΩ,在高电流下导致明显 I^2R 损耗,应评估 PCB 散热与周围器件温度。
  • 电感容差 ±20% 会影响 LC 滤波截止与电流纹波,关键滤波/谐振电路请在原型中验证实际电感值。
  • 高频损耗:在高开关频率下,铁芯损耗和涡流损耗会增加,需参考厂方频率特性曲线并验证效率。

六、封装与焊接注意

  • 小封装 SMD,建议按厂方推荐的 PCB 焊盘设计与回流曲线进行贴装焊接,避免过度机械应力与热循环导致可靠性下降。
  • 回流焊后需要检查焊点完整性与器件外观,避免在高温回流或二次焊接中超出材料极限。

七、可靠性与测试要点

  • 建议在目标工作温度与最大纹波条件下进行温升测试,确认温度不超过长期可靠性限值。
  • 做电流冲击与长时间加速老化测试以验证退磁、饱和行为与阻值漂移。
  • 在设计验证阶段,测量实际电感值(在目标频率和偏置电流下)以确定其对系统性能的影响。

结论:FTC201610S1R5MBCA 以小体积和较高电流能力为核心优势,适合对封装尺寸敏感且需要稳健电流处理的小功率电源应用。在采用时应关注 DCR 带来的热耗、±20% 电感容差对滤波设计的影响,并按厂家规范做好焊接与热管理。若需更深入的频率特性、温升曲线或典型应用电路,请参照厂方完整规格书或联系供应商获取样品测试。

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