Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
cjiang FNR5040S472MT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- cjiang FNR5040S472MT
- Type
- CJIANG
- Minimum package
- 1500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJIANG
- Electronic Component
- FNR5040S472MT
- Electronic Component
- 1
- Package
- SMD
- Type
- Magnetic Display Inductor
- Electronic Component
- Power Inductor
- Electronic Component
- ±20%
- Electronic Component
- 0.579g
- Inductor
- 4.7mH
- Electronic Component
- 1
- Electronic Component
- BM0264532924
- Current
- 100mA
- Resistor(DCR)
- 45.5Ω
- Electronic Component
- Electronic Component
- Electronic Component
- 1500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FNR5040S472MT 产品概述
一、产品简介
FNR5040S472MT 是长江微电（cjiang）推出的一款 SMD 功率电感，封装尺寸约 5×5 mm，电感值 4.7 mH，公差 ±20%。该器件为磁胶屏蔽结构，面向低电流、高阻抗的滤波与抑制干扰场景设计，型号适用于要求体积小、安装方便的表面贴装应用。
二、主要电气参数
- 电感值：4.7 mH ±20%
- 额定电流（Irated）：100 mA（连续）
- 饱和电流（Isat）：130 mA（典型）
- 直流电阻（DCR）：45.5 Ω
- 类型：磁胶屏蔽电感（功率/滤波用）
这些参数表明器件在低电流下可提供较大的感抗，但直流电阻较高，连续通过较大电流时会产生明显的 I^2R 损耗与发热。
三、特点与适用场景
- 小尺寸 SMD，便于自动贴装和高密度 PCB 布局。
- 适用于电源滤波、输入/输出噪声抑制、音频前端滤波以及低功耗模块的干扰隔离。
- 由于 DCR 较大，推荐用于电流较小或需要额外串联阻抗的场合（如 EMI 滤波、开关噪声衰减），不适合作为高电流能量传递的储能电感。
四、设计与使用建议
- 电流与发热：按额定 100 mA 连续工作时，I^2·R 损耗为可观数值（需评估 PCB 散热与环境温升），尽量留有余量，避免长期接近 Isat 以免退磁或饱和导致电感值下降。
- 饱和裕度：设计时建议将工作电流控制在额定值以下的 60%~80% 范围内以保证线性工作区间和长期可靠性。
- PCB 布局：两端焊盘应保证良好焊接，必要时在周围留出散热铜箔；避免将热源紧邻器件。
- 回流焊接：推荐按制造商提供的回流曲线焊接，避免超过封装与粘接材料的温度极限。
五、包装与选型提示
- 封装：SMD，5×5 mm，适合自动化 SMT 生产线。
- 选型时除关注电感值与电流参数外，应重点考察 DCR 对系统损耗及温升的影响；若系统需传输较大电流或要求低损耗，应优先考虑低 DCR 或更大额定电流的电感型号。
如需详细电气波形、频率响应或回流焊曲线建议，建议联系供应商获取完整版规格书与可靠性测试数据，以便在具体电路中做精确评估。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
