WMSIC Electronic Components

cjiang FXL0650-6R8-M FXL0650

ModelFXL0650-6R8-M
PackageSMD,6.6x7mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FXL0650-6R8-M
Type
CJIANG
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FXL0650-6R8-M
Electronic Component
1
Package
SMD,6.6x7mm
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
1.543g
Inductor
6.8uH
Electronic Component
1
Electronic Component
BM0233298864
Current
5.8A
Resistor(DCR)
41mΩ
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FXL0650-6R8-M 产品概述

FXL0650-6R8-M 是长江微电(cjiang)推出的一款一体成型功率贴片电感,封装尺寸 6.6 × 7.0 mm,标称电感值 6.8 μH,公差 ±20%,面向中高电流开关电源与功率滤波应用。该器件以较高的额定电流与紧凑体积为设计目标,适合降压转换器、LED 驱动、电池管理与汽车电子等需要大电流滤波的场景。

一 关键电气参数

  • 品牌:cjiang(长江微电)
  • 型号:FXL0650-6R8-M
  • 电感值:6.8 μH(±20%)
  • 额定电流(Irated):5.8 A(连续工作电流参考)
  • 饱和电流(Isat):6.3 A(饱和时 L 降到标称值的通常百分比,见数据手册)
  • 直流电阻(DCR):约 41 mΩ
  • 封装:SMD,一体成型(molded)
  • 尺寸:6.6 × 7.0 mm

二 特性与优势

  • 高电流能力:额定电流接近 6 A,适合中高电流 DC–DC 变换器输出滤波。
  • 紧凑封装:6.6 × 7.0 mm 的 SMD 外形便于自动贴装与密集布局。
  • 一体成型结构:机械强度好、抗震性能优于松散绕制器件,适合工业与汽车环境。
  • 可替代传统绕线功率电感,用于减小电源模块体积并保持较高电流通过能力。

三 性能注意点(关键提示)

  • 损耗与发热:DCR = 41 mΩ 意味着在额定电流 5.8 A 下的 I^2R 损耗约为 1.38 W(估算值),器件会显著发热,设计时需做好散热与电流退让(derating)。
  • 饱和裕度小:Isat 仅比额定电流高约 8.6%,短时冲击电流可接受,但长期靠近 Isat 工作会导致电感值急降,影响转换器性能。建议连续工作电流选定在 Irated 的 70%~85% 范围内,或遵循系统负载峰值与热预算进行选择。
  • 直流偏置效应:磁芯在直流偏置下电感会下降,设计时应参考厂家 L–I 曲线(数据手册)以确认工作点下的实际电感值。

四 典型应用

  • 同步/非同步降压转换器(buck 输出滤波)
  • LED 驱动与恒流电源
  • 电池管理与充放电电源模块
  • 工业控制与通信设备的电源滤波
  • 汽车电子低频滤波(需验证温度与振动规格)

五 PCB 布局与使用建议

  • 大面积铜箔:为降低温升与 DCR 造成的热负荷,器件两侧尽可能铺设大面积铜箔并连接至散热层。
  • 多点焊盘与过孔:若可能,在电感下方或附近布置散热过孔引导热量到内层或背面铜层。
  • 尽量缩短输入与输出回路的环路面积,电感与开关 MOSFET/二极管之间走线应最短以减少 EMI。
  • 留出足够间距以便热流散发和波峰焊/回流焊可靠性。
  • 在设计时参考元件的 L–I 与温度上升曲线,预估转换器在最大负载下的电感值与温度。

六 焊接与可靠性提示

  • 一体成型封装适合回流焊流程,遵循 JEDEC/IPC 关于温度曲线的规范;具体回流曲线以厂方资料为准。
  • 贮存与环境:常见类似器件的工作温度范围通常为 -40°C 到 +125°C,请以厂家数据手册为准验证高温下的电感衰减与寿命。
  • 机械可靠性:一体成型结构抗振动与机械应力能力较好,但在强烈冲击或反复热循环场景中仍需做可靠性验证。

七 选型与替代建议

  • 若系统对效率和温升敏感,考虑选择更低 DCR 或更高 Isat 的型号以降低 I^2R 损耗。
  • 如需更小体积或更高电流,可在同类产品中比较 DCR、Isat 与 L–I 曲线以权衡体积与性能。
  • 设计冗余:在峰值电流较高的应用中,可并联相同型号电感或并联使用多个相位(多相方案)以降低单颗器件热负荷。

八 总结

FXL0650-6R8-M 是面向中高电流功率滤波的实用型一体成型 SMD 电感,适合降压模块与功率滤波场合。其主要优势是较高的额定电流与紧凑封装,但应重视 DCR 导致的功耗与发热、以及靠近饱和电流工作的风险。推荐在最终选型前索取并核对厂家完整数据手册(包括 L–I 曲线、温升测试、回流曲线与环境等级),并在目标系统中做热和电磁兼容验证。若需更详细的 PCB 封装建议或热评估,可以提供电路工作条件(工作电流、开关频率、输入/输出电压)以获得针对性的方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.