Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
cjiang FNR5040S3R3NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- cjiang FNR5040S3R3NT
- Type
- CJIANG
- Minimum package
- 1500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJIANG
- Electronic Component
- FNR5040S3R3NT
- Electronic Component
- 1
- Package
- SMD
- Type
- Magnetic Display Inductor
- Electronic Component
- Power Inductor
- Electronic Component
- ±30%
- Electronic Component
- 0.579g
- Inductor
- 3.3uH
- Electronic Component
- 1
- Electronic Component
- BM0258614575
- Current
- 3.9A
- Resistor(DCR)
- 31mΩ
- Electronic Component
- Electronic Component
- Electronic Component
- 1500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FNR5040S3R3NT 产品概述
一、产品简介
FNR5040S3R3NT 是长江微电（cjiang）出品的一款面向功率应用的磁胶屏蔽贴片电感，标称电感值 3.3 μH，公差 ±30%。器件采用 5×5 mm SMD 封装，结合屏蔽结构与磁胶工艺，在体积受限的开关电源和DC–DC变换器中提供稳定的储能与电流滤波能力。
二、主要性能参数
- 电感值：3.3 μH（±30%）
- 额定电流（Irated）：3.9 A（长期工作电流建议）
- 饱和电流（Isat）：4.45 A（接近或超过时电感显著下降）
- 直流电阻（DCR）：31 mΩ
- 类型：磁胶屏蔽电感（功率型）
- 封装：SMD，外形尺寸 5×5 mm
三、特性与优势
- 宽公差（±30%）适合功率储能和噪声抑制，对精密谐振回路要求不高的场合更经济。
- 磁胶屏蔽结构减少磁通泄漏和 EMI 干扰，便于密集布板和多通道并排布置。
- 低 DCR（31 mΩ）在高电流下仍能控制铜损，但在接近额定电流时仍会产生可观的功耗（例如 3.9 A 时 I^2·R ≈0.47 W），需考虑散热与热稳定性。
- Isat = 4.45 A 指示在短时或异常负载下电感保持工作的上限，设计应避免长期进入饱和区以免 L 值骤降影响稳态性能。
四、典型应用场景
- 同步/非同步降压（buck）转换器的电感储能单元
- 电源滤波（输入/输出滤波）与电流纹波抑制
- 汽车电子、工控与通信设备中需要高电流、受控磁辐射的小型化电源模块
五、封装与焊接建议
- 推荐采用符合厂家推荐的 PCB 焊盘风格与回流焊曲线，避免过度机械应力。
- 对于高电流工作，建议在器件下方或周围设计热释/散热铜箔与过孔，改善散热路径。
- 布局时尽量缩短与 MOSFET/电容之间的连接长度，减小串联寄生电感与噪声源环路面积。
六、选型与使用注意
- 若电流常态接近 3.9 A，应评估温升与长期老化，必要时选用额定电流更高或并联电感降低 DCR。
- ±30% 容差适合大多数开关电源，但对稳压精度或谐振频率敏感的应用需谨慎。
- 饱和电流并非绝对断电值，超过 Isat 会出现感值下降，应留有一定余量以保证系统稳定。
FNR5040S3R3NT 以其 5×5 mm 的紧凑外形、较高电流承载能力和屏蔽特性，适用于中小功率的开关电源与滤波场景；在实际设计中应结合散热、纹波、电流裕量进行综合评估，确保长期可靠运行。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
