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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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TCC0402COG100J500AT 是一款由CCTC(三环)公司生产的贴片多层陶瓷电容(MLCC),具有高精度、高稳定性和优异的温度特性。该电容广泛应用于各种电子设备中,特别是在需要高可靠性和稳定性的电路中,如射频(RF)电路、振荡电路、滤波电路等。
TCC0402COG100J500AT 采用C0G(NP0)材质,这种材质具有极低的温度系数,通常在±30ppm/°C范围内。这意味着在广泛的温度范围内,电容的容值变化非常小,确保了电路的高稳定性和可靠性。C0G材质的电容特别适用于对温度变化敏感的应用场景,如精密计时电路、高频电路和温度补偿电路。
该电容的容值为10pF,精度为±5%。这种高精度的电容能够确保电路设计的精确性,减少因容值偏差引起的电路性能波动。在需要高精度匹配的电路中,如滤波器和谐振电路,TCC0402COG100J500AT 能够提供稳定的性能。
TCC0402COG100J500AT 的额定电压为50V,这意味着它能够在高达50V的电压下稳定工作。这种高额定电压使得该电容适用于各种高压电路,如电源滤波电路和高压信号处理电路。
该电容采用0402封装,尺寸为1.0mm x 0.5mm。这种小型封装使得TCC0402COG100J500AT 非常适合高密度电路板设计,特别是在空间受限的便携式电子设备中,如智能手机、平板电脑和可穿戴设备。
TCC0402COG100J500AT 广泛应用于各种电子设备中,包括但不限于:
TCC0402COG100J500AT 由CCTC(三环)公司生产,该公司在电子元器件领域拥有丰富的经验和高度的信誉。CCTC公司严格的质量控制体系确保了每一颗电容的高可靠性和一致性,使其能够满足各种严苛的应用需求。
TCC0402COG100J500AT 是一款高性能的贴片多层陶瓷电容,具有高精度、高稳定性和优异的温度特性。其C0G材质、±5%的精度、50V的额定电压和0402封装使其广泛应用于各种电子设备中,特别是在需要高可靠性和稳定性的电路中。CCTC公司的品牌保证进一步确保了该电容的高质量和可靠性,使其成为电子设计工程师的理想选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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