Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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TCC0402COG220J500AT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容(MLCC),具有高精度、高稳定性和优异的温度特性。该电容广泛应用于各种电子设备中,特别是在需要高频率、低损耗和高可靠性的电路中。
TCC0402COG220J500AT 的标称容值为 22pF,精度为 ±5%。这意味着在实际应用中,电容的容值可以在 20.9pF 到 23.1pF 之间波动。这种高精度的容值使得该电容非常适合用于需要精确电容值的电路,如滤波电路、振荡电路和定时电路等。
该电容采用 C0G(也称为 NP0)材质,这种材质具有极低的温度系数,通常在 -55°C 到 +125°C 的温度范围内,容值变化不超过 ±30ppm/°C。这种优异的温度稳定性使得 TCC0402COG220J500AT 在宽温度范围内都能保持稳定的性能,适用于高精度和高稳定性的应用场景。
TCC0402COG220J500AT 的额定电压为 50V,这意味着在正常工作条件下,电容可以承受的最大电压为 50V。这种高额定电压使得该电容适用于各种高压电路,如电源滤波、信号耦合和去耦等。
该电容采用 0402 封装,尺寸为 1.0mm x 0.5mm。这种小型封装使得 TCC0402COG220J500AT 非常适合用于高密度电路板设计,特别是在空间受限的便携式电子设备中,如智能手机、平板电脑和可穿戴设备等。
TCC0402COG220J500AT 由于其高精度、高稳定性和小型封装,广泛应用于以下领域:
TCC0402COG220J500AT 由 CCTC(三环)公司生产,该公司是中国领先的电子元器件制造商之一,以其高质量和可靠性而闻名。CCTC 的产品经过严格的质量控制和测试,确保在各种应用场景下都能提供稳定的性能。
TCC0402COG220J500AT 是一款高性能的贴片多层陶瓷电容,具有高精度、高稳定性和优异的温度特性。其小型封装和高额定电压使得它非常适合用于各种高密度和高性能的电子设备中。无论是通信设备、消费电子、工业控制还是汽车电子,TCC0402COG220J500AT 都能提供可靠的电容解决方案。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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