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CCTC TCC0402X5R394K160AT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC0402X5R394K160AT
- Type
- CCTC
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC0402X5R394K160AT
- Electronic Component
- 1
- Electronic Component
- 390nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0263668619
- Electronic Component
- X5R
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CCTC0402X5R394K160AT 贴片多层陶瓷电容（MLCC）产品概述
一、产品核心身份与定位
该产品为三环电子（CCTC） 推出的0402封装贴片多层陶瓷电容（MLCC），属于中温稳定型电容系列，专为小型化、高密度电子设备设计。其兼顾容量精度与温度稳定性，适配常规电路的滤波、耦合、去耦等核心需求，是消费电子、小型工业设备的高性价比选择。
二、关键技术参数解析
产品型号编码直接映射核心参数，具体如下：
- 容量：390nF（型号中“394”表示39×10⁴pF=390nF）；
- 精度：±10%（“K”为国际标准精度代码）；
- 额定电压：16V DC（“160”明确标注电压等级）；
- 温度系数：X5R（IEC标准定义：工作温度-55℃~+85℃，电容变化率≤±15%）；
- 封装：0402（英制0.04×0.02英寸，公制1.016×0.508mm）。
这些参数匹配大多数低压电路需求，无需额外降额即可覆盖常规工作场景。
三、封装与物理特性
采用0402超小型贴片封装，是电子设备小型化的主流选择，物理尺寸（典型值）：
- 长度：1.016mm±0.05mm；
- 宽度：0.508mm±0.05mm；
- 厚度：0.5mm±0.05mm（含电极）。
封装结构为陶瓷基片+镍电极叠层，表面镀锡，适配回流焊、波峰焊等标准工艺，焊接可靠性符合IPC-A-610标准，可兼容最小0.2mm焊盘间距的高密度PCB。
四、温度特性与稳定性
X5R温度系数是该产品的核心优势：
- 工作温度覆盖**-55℃至+85℃**，满足户外设备、车载辅助系统（非高温区）、消费电子的温度需求；
- 电容随温度波动≤±15%，远优于Y5V等低成本电容（波动可达+22%/-82%），能稳定维持电路性能；
- 无极性设计，安装无正反要求，降低生产出错率。
五、典型应用场景
基于参数与封装特性，该电容广泛应用于：
- 消费电子：智能手机/平板的电源滤波、蓝牙/WiFi模块信号耦合、耳机接口去耦；
- 小型家电：智能插座、加湿器、遥控器控制板；
- 工业控制：小型传感器模块、PLC辅助电路滤波；
- 汽车电子：车载USB充电口、仪表盘辅助电路（非高温区）。
16V电压适配低压电路，390nF容量适合10kHz~100MHz频率范围的滤波需求。
六、品牌与品质保障
三环电子（CCTC）是国内MLCC头部厂商，该产品符合：
- 环保标准：RoHS 2.0、REACH（无铅、无镉、无汞）；
- 可靠性测试：通过高温存储（125℃×1000h）、温度循环（-55℃~+85℃×500次）、湿度老化等测试，MTBF≥10⁶小时；
- 供货能力：量产稳定，编带包装（10k/盘）适配自动化贴装，可满足中小批量至大规模生产需求。
该产品以高性价比、稳定性能适配多场景，是电子设计中低压中容值MLCC的优选方案。
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