WMSIC Electronic Components

CCTC TCC0402COG1R5B500AT MLCC TCC0402COG1R5B500AT

ModelTCC0402COG1R5B500AT
Package0402
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

14 specifications

Core information

Product name
CCTC TCC0402COG1R5B500AT
Type
CCTC
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0402COG1R5B500AT
Electronic Component
1
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.012g
Electronic Component
1
Electronic Component
BM0265810842
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0402COG1R5B500AT 贴片陶瓷电容产品概述

一、产品定位与品牌背景

TCC0402COG1R5B500AT是国内陶瓷元器件龙头三环集团(CCTC) 推出的高精度高频贴片陶瓷电容,属于该品牌TCC系列核心产品。三环集团深耕陶瓷电容领域数十年,具备从陶瓷粉体原材料到成品的全产业链布局,产品以高可靠性、低温度漂移、高精度为核心竞争力,广泛替代进口同规格产品,应用于通信、射频、工业控制等严苛场景。

二、核心电气参数与特性

该电容参数符合行业高精度高频标准,关键指标如下:

  1. 容值与精度:标称容值1.5pF,绝对精度±0.1pF(相对精度约6.7%),满足谐振回路、精密滤波对绝对容值稳定的需求;
  2. 温度系数:采用C0G(NPO) 特性,在-55℃至+125℃宽温范围内,容值变化率≤±30ppm/℃(即漂移≤0.03%),是陶瓷电容中温度稳定性最优类别;
  3. 额定电压:额定DC电压50V,实际建议降额至37.5V(降额25%),可显著提升长期可靠性;
  4. 损耗特性:1kHz/25℃下损耗角正切值(tanδ)≤0.0001,低损耗适配射频电路信号传输,避免能量损耗。

三、封装与物理特性

该电容采用0402英制贴片封装(对应公制1005,长1.0mm×宽0.5mm),物理尺寸紧凑,适配高密度PCB设计(如智能手机、可穿戴设备主板);厚度仅0.5mm,满足薄型化产品空间要求。端电极采用镀金工艺,焊接兼容性好,可适配回流焊、波峰焊,焊接后可靠性符合IPC-A-610标准。

四、典型应用场景

因性能特性,该型号广泛应用于:

  1. 射频通信:蓝牙5.0/5.1、WiFi 6/6E模块的耦合、滤波与谐振回路;
  2. 精密仪器:示波器、信号发生器、频谱分析仪的高频信号调理电路;
  3. 消费电子:智能手机射频天线匹配、可穿戴设备传感器滤波;
  4. 工业控制:PLC高频通信接口滤波,确保信号稳定传输。

五、性能优势总结

相比同封装普通电容(如X7R/Y5V),核心优势:

  1. 温度稳定性优异:C0G彻底解决X7R(-55℃至+125℃漂移≤±15%)的温度漂移问题,适合宽温环境;
  2. 高精度绝对容值:±0.1pF绝对精度远高于普通电容(±5%~±10%相对精度),满足谐振回路频率精度要求;
  3. 小体积高密度:0402封装适配小型化设备,单位面积集成更多电容;
  4. 高可靠性:三环全产业链工艺(粉体粒度、端电极附着力控制)确保长期无失效风险。

六、应用注意事项

  1. 焊接工艺:回流焊温度控制在220℃~240℃(峰值≤260℃),避免过温损伤;
  2. 静电防护:陶瓷电容易受静电损伤,生产需佩戴防静电手环、使用防静电工作台;
  3. 降额使用:实际工作电压≤37.5V,延长产品寿命;
  4. PCB设计:焊盘尺寸符合IPC-7351标准(长0.6mm×宽0.3mm),确保焊接可靠性。

该型号兼顾高性能与成本优势,是高频、高精度电路设计的优选方案。

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