WMSIC Electronic Components

CCTC TCC0402X7R751K500AT

ModelTCC0402X7R751K500AT
Package0402
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC0402X7R751K500AT
Type
CCTC
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0402X7R751K500AT
Electronic Component
1
Electronic Component
750pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.012g
Electronic Component
10
Electronic Component
BM0265811018
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0402X7R751K500AT 贴片电容(MLCC)产品概述

一、产品核心身份定位

这款电容是三环电子(CCTC) 推出的常规型多层陶瓷贴片电容(MLCC),型号为TCC0402X7R751K500AT。核心参数清晰明确:

  • 容值:750pF(对应编码“751”,即75×10¹ pF);
  • 精度:±10%(编码“K”,属于常规精度档);
  • 额定电压:直流50V(编码“500”);
  • 温度特性:X7R(温度范围-55℃~+125℃,容值变化≤±15%);
  • 封装:0402(英制尺寸,公制为1.0mm×0.5mm)。

作为中低端应用的主力型号,它兼顾了小体积、中等容值和宽温度适应性,是电子电路中最常用的滤波、去耦元件之一。

二、封装与物理尺寸细节

0402封装是贴片电容的“迷你款”,专为高密度表面贴装设计:

  • 外形尺寸:长1.0±0.1mm,宽0.5±0.1mm,典型厚度0.5±0.05mm(具体厚度因生产批次略有差异,可参考三环官方 datasheet);
  • 电极结构:两端采用镍/锡镀层(Ni/Sn),适配标准SMT焊接工艺,焊接时可与PCB焊盘牢固结合;
  • 外观特征:白色陶瓷基体,两端银色电极,无极性标识(MLCC本身无极性,安装无需区分正反)。

小体积特性让它能在手机、智能穿戴等空间紧凑的产品中大量使用,单块PCB可贴装数千颗,不影响整体尺寸。

三、材料与温度稳定性分析

X7R是这款电容的核心材料,属于铁电陶瓷,介电常数(εr)约为2000~4000,比NPO(低温漂材料)高得多,因此小封装能实现较大容值(750pF在0402封装中属于常规容量)。

温度特性是X7R的关键优势:

  • 工作温度范围:-55℃(低温极限)~+125℃(高温极限),覆盖绝大多数消费电子、工业场景的环境温度;
  • 容值变化:在全温度范围内,容值变化不超过±15%(远优于Y5V材料的±20%~±82%),但略逊于NPO的±0.05%(但NPO容值通常≤100pF,无法满足750pF需求)。

这种“平衡型”材料特性,让它既适合一般温度变化的场景,又能在小封装下提供足够容值,成本也比高精度NPO低很多。

四、关键电气性能参数

除了基础参数,以下电气指标直接影响实际使用效果:

  1. 损耗角正切(DF):典型值≤2.5%(测试条件:1kHz、25℃),表示电容在交流电路中的能量损耗,该值越低,滤波效果越好,适合信号电路;
  2. 绝缘电阻(IR):典型值≥7.5GΩ(测试条件:25℃、50V DC),对应公式为IR≥10⁴ MΩ·μF(750pF=0.75μF,故10⁴×0.75=7.5×10³ MΩ=7.5GΩ),绝缘电阻越高,漏电流越小,适合电源滤波;
  3. 额定电压:直流50V,实际使用时建议降额至40V以下(80%额定电压),避免长期过压导致容值下降或失效;
  4. 交流耐压:在1kHz频率下,交流耐压约为35V(因MLCC交流耐压随频率升高而降低,需注意使用场景)。

这些参数均符合IEC 60384-1国际标准,能满足大多数常规电路的电气要求。

五、典型应用场景

由于体积小、容值适中、温度适应性好,这款电容广泛用于:

  • 消费电子:手机、平板、智能手表的主板电源去耦、信号滤波(比如CPU供电回路的去耦电容);
  • 通信设备:路由器、交换机的射频模块辅助滤波、电源电路稳压;
  • 工业控制:小型PLC模块、传感器节点的信号调理电路;
  • 汽车电子(若符合AEC-Q200认证):车载中控、仪表盘的低功率电路(三环部分型号通过汽车级认证,需确认具体批次);
  • 电源产品:DC-DC转换器、USB充电器的输入输出滤波电容(50V电压适合中等功率电源)。

六、可靠性与质量保证

三环电子作为国内MLCC龙头企业,这款产品的可靠性有保障:

  • 环保认证:符合RoHS 2.0、REACH等国际环保标准,无铅无镉;
  • 工艺兼容性:可通过回流焊、波峰焊(0402封装更推荐回流焊,波峰焊需控制温度≤240℃),焊接良率≥99%;
  • 可靠性测试:通过高温负荷寿命(HTOL:125℃、50V、1000小时)、温度循环(-55℃~+125℃、1000次)、湿度负荷(85℃、85%RH、50V、1000小时)等测试,失效概率极低;
  • 批量稳定性:三环拥有成熟的MLCC生产线,产能稳定,适合大规模量产需求。

七、选型与使用注意事项

  1. 电压降额:实际工作电压不超过额定电压的80%(40V),避免长期过压导致性能衰减;
  2. 温度限制:工作环境温度不超过125℃,若超过则容值变化会超出±15%,影响电路性能;
  3. 焊接工艺:回流焊峰值温度控制在230~245℃,时间不超过30秒,避免热应力导致陶瓷开裂;
  4. 容值匹配:若对温度稳定性要求极高(比如射频电路),可选择NPO材料,但容值需降低;若需要更大容值(比如1μF以上),可选择Y5V材料,但温度变化较大;
  5. 库存管理:MLCC无极性,但需注意封装尺寸(0402与0603、0805不可混用),避免贴装错误。

这款电容凭借“小体积+中等容值+宽温特性”的组合,成为电子电路中“万金油”式的元件,适合绝大多数常规设计需求。

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