WMSIC Electronic Components

CCTC TCC0402COG7R0C500AT

ModelTCC0402COG7R0C500AT
Package0402
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
CCTC TCC0402COG7R0C500AT
Type
CCTC
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0402COG7R0C500AT
Electronic Component
1
Electronic Component
7pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.012g
Electronic Component
1
Electronic Component
BM0265069802
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0402COG7R0C500AT 产品概述

一、产品简介

TCC0402COG7R0C500AT 是三环(CCTC)系列的一款贴片多层陶瓷电容(MLCC),额定电压 50 V,标称容值 7 pF,采用 C0G(又称 NP0)温度特性材料,封装尺寸为 0402(约 1.0 mm × 0.5 mm)。该产品针对需要高稳定性、低损耗与低寄生效应的高频与精密电路设计,提供长期稳定的电容性能和良好的可装配性。

二、主要性能特点

  • 温度特性:C0G(NP0)介质,温漂极低,工作温度范围宽,适合对温度稳定性要求高的电路。
  • 低损耗与高 Q 值:介质损耗小,等效串联电阻(ESR)与等效串联电感(ESL)较低,适合射频、滤波与振荡电路。
  • 高稳定性:接近零老化(相比 X7R、X5R 等介质),长期容值变化极小。
  • 宽电压与温度工作区间:额定电压 50 V,典型工作温度范围 -55°C 至 +125°C(具体请参照规格书)。
  • 优良的贴装适应性:标准 0402 尺寸,兼容自动贴片与回流焊工艺,便于高密度 PCB 布局。

三、典型电气参数(建议以规格书为准)

  • 标称容值:7 pF
  • 额定电压:50 V DC
  • 温度系数:C0G / NP0(典型温漂 0 ± 若干 ppm/°C,在 -55°C 至 +125°C 范围内保持高稳定性)
  • 漏电流与绝缘电阻:C0G 型号通常具备极低漏电流与高绝缘电阻(具体数值请参考三环规格表)
  • 等效串联电阻/电感:适合高频应用,表现为低 ESR/低 ESL
  • 容差、厚度与尺寸:0402 外形(约 1.0 mm × 0.5 mm,厚度视工艺而定),容差有多种可选,订购时请确认容差代码与规格。

四、典型应用场景

  • 射频前端:谐振回路、阻抗匹配、滤波器与谐振器件中对容值与温漂稳定性要求高的场合。
  • 时钟与振荡电路:晶体/振荡器旁路与负载电容,对频率稳定性影响敏感。
  • 精密模拟电路:运算放大器、采样电路、基准电路的耦合与去耦应用。
  • 测量仪器与医疗电子:对长期稳定性与低漂移要求严格的系统。
  • 高频信号路径:由于低损耗与高 Q 值,适合在 GHz 级别仍保持良好性能的场合。

五、封装与焊接建议

  • 尺寸说明:0402(EIA)尺寸约 0.04" × 0.02"(≈1.0 mm × 0.5 mm),适合高密度贴装。实际厚度与尺寸公差请参见厂方尺寸图。
  • 包装方式:常见为卷带(Tape & Reel),兼容自动贴片机取放;具体卷盘数量与盘内序列请按采购页或规格书确认。
  • 回流焊规范:建议按 IPC/JEDEC 无铅回流曲线进行焊接,峰值温度 ≤ 260°C,避免快速热冲击与反复多次回流。
  • PCB 设计建议:参考 IPC 推荐的 0402 焊盘尺寸与焊膏印刷模板,以保证焊点质量与贴装良率;保持良好的焊盘余量以利于热膨胀释放。
  • 贮存与处理:避免潮湿环境长时间暴露,贴片前若规格书建议进行烘烤请按规范执行;搬运时注意防静电与机械冲击。

六、可靠性与品质保证

  • 可靠性测试:该类 C0G MLCC 通常经过温度循环、湿热、机械冲击、振动与高温烘烤等可靠性试验。
  • 质量控制:三环(CCTC)作为元件制造商,通常提供批次检测报告与出厂测试数据,具体认证与测试标准(如 AEC-Q200 等)请参阅产品规格文件或向代理商确认。
  • 寿命与漂移:C0G 材料本身具有极低电容老化特性,适合对长期稳定性有严格要求的应用。

七、选型与使用注意事项

  • 容差与频率特性:在高频应用中,除容值外应关注 ESR、ESL 与自谐频率(自谐点)等参数;选型时优先参考厂方频率响应曲线。
  • 电压系数:尽管 C0G 的电压依赖性很小,但在高偏压或脉冲环境下仍需确认在实际工作电压下的容值变化。
  • 环境适应性:确定工作温度与湿度条件,必要时选择通过相应军工或工业等级认证的型号。
  • 订购信息:下单前请确认完整料号、容差、包装方式与所需批次证书,必要时要求样品进行实际评估。

如需产品规格书(datasheet)、频率响应曲线、尺寸图或样品支持,可提供具体联系方式或告知所需资料,我可协助准备与核对。

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