Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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TCC0603X7R333K500CT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容(MLCC),具有高可靠性、优异的电气性能和广泛的应用范围。该电容采用 X7R 介质材料,具有稳定的温度特性和较高的容值精度,适用于各种电子电路中的滤波、耦合、旁路等应用。
TCC0603X7R333K500CT 的标称容值为 33nF,容值精度为 ±10%。这意味着在实际应用中,电容的容值可能在 29.7nF 至 36.3nF 之间波动。这种精度水平适用于大多数通用电子电路,尤其是在对容值要求不特别严格的场合。
该电容采用 X7R 介质材料,X7R 是一种具有中等温度稳定性的陶瓷材料。在 -55°C 至 +125°C 的温度范围内,X7R 材料的电容变化率不超过 ±15%。这种温度特性使得 TCC0603X7R333K500CT 适用于需要在较宽温度范围内稳定工作的电子设备。
TCC0603X7R333K500CT 的额定电压为 50V,这意味着它可以在不超过 50V 的直流电压下长期稳定工作。对于大多数低电压应用,如消费电子产品、通信设备和工业控制系统,50V 的额定电压提供了足够的安全裕度。
该电容采用 0603 封装,尺寸为 1.6mm x 0.8mm。这种小型封装使得 TCC0603X7R333K500CT 非常适合高密度 PCB 布局,尤其是在空间受限的便携式设备和微型电子模块中。
TCC0603X7R333K500CT 广泛应用于各种电子设备和系统中,包括但不限于:
TCC0603X7R333K500CT 由 CCTC(三环)公司生产,CCTC 是中国领先的电子元器件制造商之一,以其高质量的产品和可靠的服务在业界享有盛誉。CCTC 的产品经过严格的质量控制和测试,确保在各种应用环境中都能提供稳定的性能。
TCC0603X7R333K500CT 是一款高性能的贴片多层陶瓷电容,具有 33nF 的容值、±10% 的精度、50V 的额定电压和 0603 的封装尺寸。其 X7R 介质材料提供了良好的温度稳定性,适用于广泛的应用领域。无论是消费电子、通信设备、工业控制还是汽车电子,TCC0603X7R333K500CT 都能提供可靠的电容解决方案。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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