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CCTC TCC0402X5R184K250AT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC0402X5R184K250AT
- Type
- CCTC
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC0402X5R184K250AT
- Electronic Component
- 1
- Electronic Component
- 180nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0264907397
- Electronic Component
- X5R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0402X5R184K250AT 产品概述
一、产品概述
TCC0402X5R184K250AT 为 CCTC（三环）系列贴片多层陶瓷电容（MLCC），容值 180nF（0.18µF），额定电压 25V，容差 ±10%（K），介质为 X5R，封装 0402。该型号面向对体积与容量有较高要求的小型化电路，兼顾良好的频率响应与低等效串联电阻（ESR），适合高密度 PCB 设计中的去耦、滤波与储能应用。
二、主要参数
- 容值：180nF（0.18µF）
- 容差：±10%（K）
- 额定电压：25V DC
- 介质：X5R（典型温度特性：-55°C 至 +85°C 范围内电容变化在 ±15% 级别）
- 封装：0402（典型外形约 1.0 mm × 0.5 mm）
- 制造商：CCTC（三环），型号含义：0402（封装） X5R（介质） 184（180nF） K（±10%） 250（25V）
三、产品特性与优势
- 体积小、容量密度高：在 0402 小封装中提供 0.18µF 的容量，适用于空间受限的移动设备与便携终端。
- 低 ESR、低 ESL：适合高频旁路与快速瞬态响应，改善电源稳定性。
- 工艺可靠：适配常见回流焊工艺，符合无铅、RoHS 要求；耐焊接温度性能优良。
- 成本与通用性平衡：X5R 介质在容量稳定性与成本间取得良好折衷，适用于大多数电子系统的去耦与滤波需求。
四、典型应用场景
- 电源去耦与旁路（CPU、PMIC、电源转换器输出/输入）
- 高频滤波、射频前端的旁路元件（非高精度耦合场合）
- 移动设备、可穿戴设备、消费电子、工业控制的去耦与储能
- 一般模拟电路的旁路与噪声抑制（注意 X5R 对精密计时/高稳定度用途并非最佳选择）
五、设计与使用建议
- 注意直流偏置效应：X5R 在高直流偏置下电容会下降，尤其在高电压接近额定值时需留有裕量；在关键电路应做实测或预留更大名义容量。
- 温度影响：X5R 在温度变化时容值波动较 C0G/NP0 大，不能用于高精度计时或温漂敏感的场合。
- 焊盘与回流：遵循厂商建议的 PCB 焊盘和回流曲线，避免过度机械应力导致裂纹或失效。
- 储存与清洁：避免潮湿和强酸碱清洗溶液，回流后若需清洗请选择对陶瓷件无腐蚀的工艺。
六、包装与订购信息
- 常见包装形式为卷盘（Reel），适配自动贴片机。
- 选型时请确认批次、DERATING 要求与库存可用性，必要时向供应商索取样片或 S-参数测试数据以验证在目标电压/温度下的实际电容保有率。
如需该型号在特定电压偏置、频率或温度下的详细电容-电压（C-V）曲线、等效串联电阻（ESR）与寿命试验报告，可提供进一步支持与测试建议。
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