Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
稳定的温度适应性
X5R材质是常规MLCC的主流选择,在-55℃至+85℃的宽温度范围内,容值变化不超过±15%,避免因环境温度波动导致电路性能漂移——比如户外通信设备、车载电子(常温环境)等场景均能稳定工作。
小体积高密度布局
0402封装是目前消费电子的主流小型化封装,体积仅为0.5×1.0mm,可适配智能手机、智能手环等高密度PCB设计,有效节省空间的同时不影响电路性能。
低压场景精准匹配
16V额定电压覆盖了80%以上的低压直流电路需求:无需额外降额过多(建议实际工作电压≤12.8V),即可稳定用于电源滤波、信号耦合等环节,避免成本浪费。
常规精度性价比突出
±10%的精度等级满足绝大多数民用电子设备的要求(如音频滤波、电源稳压),无需追求高精度带来的成本提升,适合批量生产场景。
环保与可靠性
符合RoHS 6项环保标准(无铅无卤),采用三环成熟的多层陶瓷叠层工艺,抗机械应力能力强,长期使用失效率低(平均无故障时间≥10万小时)。
消费电子终端
通信与网络设备
工业物联网节点
三环电子是国内MLCC领域的主流厂商,拥有20余年陶瓷电容生产经验,年产能超300亿只,产品通过ISO 9001、ISO 14001及AEC-Q200(车载级)认证,广泛应用于华为、小米等国内企业及东南亚出口市场,性价比优于同规格进口品牌。
该产品以“小体积、稳性能、高性价比”为核心,是常规低压电子电路的优选MLCC方案。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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