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CCTC TCC0805X7R104K101DT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC0805X7R104K101DT
- Type
- CCTC
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC0805X7R104K101DT
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.068g
- Electronic Component
- 1
- Electronic Component
- BM0264458243
- Electronic Component
- X7R
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0805X7R104K101DT 贴片陶瓷电容（MLCC）产品概述
一、产品基本定位与命名规则
TCC0805X7R104K101DT是三环电子（CCTC） 推出的一款多层陶瓷贴片电容（MLCC），属于中温稳定型通用电容，适用于消费电子、工业控制等多场景。其型号命名遵循行业通用规则，各部分含义清晰：
- TCC：三环电子产品编码前缀；
- 0805：英制贴片封装尺寸（对应公制2012，即2.0mm×1.25mm）；
- X7R：陶瓷介质材料（温度特性稳定）；
- 104：容值编码（10×10⁴pF=100nF）；
- K：容值精度（±10%）；
- 101：额定直流电压（10×10¹V=100V）；
- DT：封装/批次标识（具体参考三环官方技术文档）。
二、核心性能参数
该电容的关键参数匹配通用场景需求，具体如下：
参数项 规格值 测试条件/备注 标称容值 100nF（104） - 容值精度 ±10%（K级） 25℃、1kHz下测试 额定直流电压（Vdc） 100V 长期工作电压上限 温度特性（X7R） -55℃~+125℃ 容值变化率≤±15%（全温区） 封装尺寸（0805） 2.0±0.2mm×1.25±0.15mm 长×宽（公制） 本体厚度 0.85±0.10mm 标准0805封装高度 损耗角正切（tanδ） ≤5% 1kHz、25℃下测试 绝缘电阻（IR） ≥10GΩ·μF 25℃、500V DC测试1分钟 环保标准 RoHS 2.0、REACH 无铅无卤，符合欧盟环保要求三、典型应用场景
基于中温稳定、中等耐压、常用容值的特性，该电容广泛应用于：
- 电源滤波：开关电源（SMPS）输入/输出滤波、线性电源稳压后滤波，抑制高频纹波；
- 去耦电容：MCU、FPGA、DSP等数字芯片电源引脚去耦，消除电源噪声；模拟电路（运放、ADC/DAC）电源去耦；
- 信号耦合/旁路：音频电路（功放、音箱）信号耦合，射频小信号（蓝牙、WiFi）旁路滤波；
- 工业控制：PLC、变频器、伺服驱动器辅助电源滤波，工业传感器信号调理电路去耦；
- 消费电子：电视、机顶盒、路由器电源模块，智能家居设备（智能音箱、摄像头）信号滤波。
四、品牌可靠性与工艺优势
三环电子（CCTC）作为国内MLCC主流供应商，该产品具备以下优势：
- 介质稳定性：X7R介质采用高纯度陶瓷粉，容值温度漂移≤±15%（-55~+125℃），优于行业标准；
- 生产工艺：多层叠层精度高，容值一致性好；电极采用镍/锡镀层，兼容回流焊、波峰焊；
- 可靠性测试：通过高温老化（125℃×1000h）、温度循环（-55~+125℃×1000次）、湿度测试（85℃/85%RH×1000h）；
- 成本优势：平衡性能与成本，适合批量应用场景。
五、应用与存储注意事项
- 焊接要求：
- 回流焊：峰值温度230~240℃，时间≤30s；升温/降温速率≤3℃/s；
- 波峰焊：峰值温度245~255℃，时间≤5s；
- 使用限制：禁止长期超100V工作，短期脉冲电压≤150%额定电压；避免PCB弯曲导致电容开裂；
- 存储条件：温度-40~+60℃，湿度≤60%；开封后12个月内使用，未开封保质期3年。
TCC0805X7R104K101DT凭借稳定的性能与高性价比，是消费电子、工业控制等领域的通用型电容优选。
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