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CCTC TCC0402COG2R7C500AT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- CCTC TCC0402COG2R7C500AT
- Type
- CCTC
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC0402COG2R7C500AT
- Electronic Component
- 1
- Electronic Component
- 2.7pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.012g
- Electronic Component
- 10
- Electronic Component
- BM0264458147
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0402COG2R7C500AT 贴片陶瓷电容产品概述
一、产品定位与品牌背景
TCC0402COG2R7C500AT是三环电子（CCTC） 推出的通用型高频稳定贴片陶瓷电容（MLCC），针对电子设备对容值温度稳定性、高频性能要求较高的场景设计，兼具小体积、高可靠性特点，覆盖消费电子、通信、工业控制等多领域。
三环电子作为国内MLCC主流厂商，拥有成熟的陶瓷介质研发与生产工艺，该产品延续了品牌在精密电容领域的技术积累，适配当前电子设备小型化、宽温化的发展需求。
二、核心电气参数详解
该产品核心参数明确，关键性能指标如下：
参数项 具体参数 说明 容值 2.7pF（标识“2R7”） 常规精度±5%（后缀“C”对应） 额定直流电压 50V（标识“500”） 实际工作电压需≤40V（80%裕量） 温度系数 C0G（即NP0） 温度系数±30ppm/℃，容值随温度变化极小 工作温度范围 -55℃ ~ 125℃ 宽温适配户外、工业高温场景 封装 0402（英制） 公制尺寸1.0mm×0.5mm，厚度≈0.5mm三、封装与物理结构
采用多层陶瓷叠层结构，核心设计特点：
- 介质与电极：C0G陶瓷介质（钛酸钡基）搭配银钯合金（Ag-Pd）内电极，兼顾低损耗与抗氧化性；
- 端电极工艺：三层结构（镍底层→铜中间层→锡表层），适配无铅焊接，焊接强度符合IPC标准；
- 尺寸紧凑：0402封装是便携设备主流选择，可有效缩小PCB布局面积，适配智能手机、可穿戴设备等高密度设计。
四、关键性能特点
- 温度稳定性优异：C0G介质容值随温度变化极小（-55℃~125℃内变化≤0.008pF），远优于X7R等温度系数较大的介质，适合精密信号处理；
- 高频低损耗：1kHz下损耗角正切（tanδ）≤0.001，2.4GHz射频频段仍保持低损耗，适配滤波、耦合、谐振电路；
- 高可靠性：无极性设计，抗振动冲击能力符合IEC 60068标准（振动20~2000Hz下承受1g，冲击峰值1500g），长期使用MTBF≥10⁶小时；
- 环境适应性强：宽温范围+防潮设计，存储时需常温干燥（湿度≤60%），受潮后105℃烘烤24小时可恢复性能。
五、典型应用场景
- 射频通信：手机射频前端滤波、WiFi/蓝牙模块耦合电容，减少信号衰减；
- 精密仪器：医疗监护仪ECG信号滤波、示波器校准电容，保证宽温下信号精度；
- 消费电子：智能手表传感器滤波、蓝牙耳机电源去耦，适配便携设备小型化；
- 工业控制：PLC输入输出模块去耦、传感器信号调理，抗电磁干扰；
- 车载辅助电子：车载蓝牙模块信号电容（非安全关键场景），适配车载宽温环境。
六、选型与使用注意事项
- 精度匹配：若需±1%高精度，需确认型号后缀为“B”（本型号“C”为±5%）；
- 电压裕量：实际工作电压需≤40V，避免过压导致介质击穿；
- 焊接工艺：回流焊峰值温度235±5℃（时间10~30秒），升温速率≤3℃/秒，防止热应力开裂；
- 静电防护：MLCC为静电敏感元件，操作需佩戴静电手环，使用防静电包装。
该产品凭借稳定的性能与紧凑的封装，成为中低端高频电路的高性价比选择，可满足多数电子设备的通用电容需求。
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