Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CCTC TCC0402X7R203K500AT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC0402X7R203K500AT
- Type
- 0402
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC0402X7R203K500AT
- Electronic Component
- 1
- Electronic Component
- 20nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0264907399
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0402X7R203K500AT 产品概述
一、产品简介
TCC0402X7R203K500AT 为 CCTC（三环）品牌的贴片多层陶瓷电容（MLCC），额定电容 20nF（标识 203），公差 ±10%（K），额定电压 50V（500），介质为 X7R，常用封装 0402（约 1.0mm × 0.5mm）。本系列针对体积受限的高密度贴片设计，兼顾可靠性与成本效率，适用于消费电子、通信与工业控制等多种场景。
二、主要特性
- 容值：20nF；公差：±10%（K）。
- 额定电压：50V DC，满足一般中低压电路需求。
- 介质：X7R（工作温度 -55°C 至 +125°C，温度特性稳定，陶瓷介电常数中等）。
- 封装：0402，适合高密度 PCB 布局与自动化贴装。
- 品牌：CCTC（三环），质量与供货稳定性良好。
三、典型应用
- 电源去耦／旁路（DC-DC 模块、PMIC、射频前端）。
- 高频滤波与旁路网络。
- 耦合/解耦、定时回路与模拟信号过滤。
- 移动设备、穿戴、物联网终端及工业控制等空间受限场合。
四、设计与使用要点
- DC 偏置效应：X7R 在高电压下会出现电容下降，实测容量可能随偏压下降，应在设计时留有裕量或测量实际偏压下容量。
- 温度影响：X7R 在 -55°C 至 +125°C 范围内容量变化受控，但仍建议关键电路测试极限温度下的性能。
- 电压降额：对于关键可靠性或精密应用，建议适当降额使用（视具体应用可采取 50%–80% 的裕量）。
- 焊接工艺：推荐使用标准回流焊工艺并遵循制造商的温度曲线与储存防潮要求，避免过度机械应力。
- PCB 布局：尽量缩短电容与被去耦芯片之间的回路，使用合适的焊盘和回流助焊膏量以降低寄生电感与阻抗。
五、封装与订购信息
型号拆分示例：TCC（品牌） 0402（封装） X7R（介质） 203（20nF） K（±10%） 500（50V） AT（卷带包装/供料形式）。具体包装、最小订购量与交期请咨询 CCTC 或授权代理。
六、测试与质量建议
建议在样板阶段进行 DC 偏压测试、温度循环与焊接后可靠性验证（如温度湿度应力、机械冲击与震动测试），以保证在目标应用条件下的长期稳定性。
如需更详细的电气参数（如典型 ESR、介质损耗、老化率或卷带规格），可提供具体应用场景后帮您向厂家索取数据手册或做可靠性评估。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
