WMSIC Electronic Components

CCTC TCC0402X7R681K500AT

ModelTCC0402X7R681K500AT
Package0402
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC0402X7R681K500AT
Type
CCTC
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0402X7R681K500AT
Electronic Component
1
Electronic Component
680pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.012g
Electronic Component
10
Electronic Component
BM0263668645
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:TCC0402X7R681K500AT 贴片电容(MLCC)

1. 产品简介

TCC0402X7R681K500AT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容(MLCC),采用 0402 封装,具有 680pF 的容值,X7R 材质,额定电压为 50V,精度为 ±10%。该产品广泛应用于各类电子设备中,尤其适用于高频电路、滤波电路、耦合电路等场景,能够提供稳定的电容性能和可靠的电气特性。

2. 关键参数

  • 商品分类:贴片电容(MLCC)
  • 容值:680pF
  • 材质(温度系数):X7R
  • 精度:±10%
  • 额定电压:50V
  • 封装:0402(1.0mm x 0.5mm)
  • 品牌:CCTC(三环)

3. 产品特点

  • 高可靠性:采用优质陶瓷材料和先进的生产工艺,确保产品在高温、高湿等恶劣环境下仍能保持稳定的性能。
  • 小尺寸:0402 封装尺寸仅为 1.0mm x 0.5mm,适合高密度 PCB 布局,满足现代电子设备小型化的需求。
  • 宽温度范围:X7R 材质具有较宽的工作温度范围(-55°C 至 +125°C),适用于各种环境条件下的应用。
  • 高精度:±10% 的精度确保了电容值的稳定性,满足高精度电路设计的需求。
  • 低 ESR 和 ESL:低等效串联电阻(ESR)和等效串联电感(ESL)特性,使其在高频应用中表现出色。

4. 应用领域

TCC0402X7R681K500AT 贴片电容广泛应用于以下领域:

  • 消费电子:智能手机、平板电脑、笔记本电脑等便携式设备中的滤波、耦合和去耦电路。
  • 通信设备:基站、路由器、交换机等通信设备中的高频电路和信号处理电路。
  • 工业控制:PLC、传感器、电机驱动器等工业控制设备中的电源管理和信号调理电路。
  • 汽车电子:车载娱乐系统、导航系统、车身控制模块等汽车电子设备中的滤波和稳压电路。
  • 医疗设备:医疗仪器、监护设备等医疗电子设备中的信号处理和电源管理电路。

5. 技术规格

  • 电容值:680pF
  • 温度系数:X7R(-55°C 至 +125°C,容值变化率 ±15%)
  • 额定电压:50V
  • 精度:±10%
  • 封装尺寸:0402(1.0mm x 0.5mm)
  • 工作温度范围:-55°C 至 +125°C
  • 绝缘电阻:≥10GΩ
  • 损耗角正切(DF):≤2.5% @ 1kHz, 1Vrms

6. 产品优势

  • 高性能:X7R 材质提供了良好的温度稳定性和电容一致性,确保在各种应用场景下都能提供可靠的性能。
  • 高性价比:CCTC 作为国内领先的电子元器件制造商,提供了高性价比的产品,满足大规模生产的需求。
  • 环保合规:产品符合 RoHS 指令,无铅无卤,符合环保要求。

7. 使用注意事项

  • 焊接条件:建议使用回流焊工艺,焊接温度曲线应符合 JEDEC J-STD-020 标准。
  • 存储条件:产品应存放在干燥、无尘的环境中,避免高温和高湿。
  • 电气应力:避免超过额定电压和温度范围使用,以防止电容损坏或性能下降。

8. 总结

TCC0402X7R681K500AT 贴片电容凭借其小尺寸、高可靠性、宽温度范围和高精度等优点,成为各类电子设备中不可或缺的元件。无论是消费电子、通信设备、工业控制还是汽车电子,该产品都能提供卓越的性能和稳定的电气特性,满足现代电子设备对高性能电容的需求。CCTC(三环)作为国内知名的电子元器件制造商,以其优质的产品和良好的服务,赢得了广泛的市场认可和客户信赖。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.