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TCC0402COG1R0C500AT是三环电子(CCTC)推出的一款小容量高频贴片MLCC,凭借稳定的C0G介质特性、50V额定电压及0402紧凑型封装,广泛适配高频通信、数字电路等对容值稳定性要求较高的场景,是电子设计中信号链路的可靠基础元器件。
该型号通过各段代码清晰传递核心参数,具体解析及基础属性如下:
参数项 具体参数 产品型号 TCC0402COG1R0C500AT 封装尺寸(英制/公制) 0402 / 1005 标称容值 1pF 容值精度 ±0.5%(典型值) 额定直流电压 50V DC 温度系数 COG(对应国际标准NP0) 介质类型 温度补偿型陶瓷 品牌 三环电子(CCTC) 封装形式 表面贴装(SMD) 工作温度范围 -55℃ ~ +125℃型号代码解析:
该产品的核心优势集中于温度稳定性、高频损耗控制及封装紧凑性,具体如下:
C0G介质属于温度补偿型陶瓷,容值随温度变化率仅**±30ppm/℃**(-55℃~125℃全温区),远优于X7R(±15%)、Y5V(±20%)等介质,可避免因温度波动导致的容值漂移,适配工业宽温、户外通信等场景。
介质损耗角正切值(DF)典型值≤0.15%(1kHz下),在GHz级高频电路中能量损耗极小,能有效保证射频信号的完整性,适合蓝牙、WiFi等无线通信链路的滤波/耦合。
0402封装体积仅1.0×0.5mm,适配高密度PCB设计;MLCC无极性、无引线电感(相比电解电容),抗干扰能力强,长期使用失效率≤1Fit(1Fit=10^-9次失效/小时),满足量产可靠性要求。
50V额定电压覆盖多数消费电子、工业控制的中低压需求,实际工作电压可在40V以内安全运行(降额80%设计),兼顾电压裕量与使用寿命。
该产品凭借上述特性,广泛应用于以下场景:
三环电子(CCTC)是国内MLCC领域头部厂商,拥有20余年研发生产经验,该产品具备以下质量优势:
综上,TCC0402COG1R0C500AT以稳定的C0G特性、紧凑封装及可靠质量,成为高频电路、数字系统中高性价比的选型方案,适配从消费电子到工业控制的多类场景需求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
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The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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