WMSIC Electronic Components

CCTC TCC0402X7R202K500AT

ModelTCC0402X7R202K500AT
Package0402
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC0402X7R202K500AT
Type
CCTC
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0402X7R202K500AT
Electronic Component
1
Electronic Component
2nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.012g
Electronic Component
10
Electronic Component
BM0265069803
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0402X7R202K500AT 贴片多层陶瓷电容(MLCC)产品概述

一、产品基本信息

TCC0402X7R202K500AT是三环电子(CCTC) 推出的通用型贴片多层陶瓷电容(MLCC),核心参数明确:

  • 容值:2nF(标识“202”=20×10²pF=2000pF);
  • 精度:±10%(标识“K”为精度档位);
  • 额定电压:50V(直流工作电压上限);
  • 温度系数:X7R(-55℃~+125℃内,容值变化≤±15%);
  • 封装:0402(英制尺寸,公制1005,长1.0mm×宽0.5mm);
  • 品牌:CCTC(三环电子,国内MLCC主流供应商)。

产品采用多层陶瓷叠层工艺,体积小、容量稳定,适配大多数低压电路的滤波、耦合需求。

二、核心性能特点

1. 宽温域稳定(X7R特性)

X7R是MLCC通用型温度系数的典型代表,-55℃至+125℃ 宽温范围内,容值波动≤±15%,无需额外温度补偿,可满足工业级、消费电子的宽温使用(如户外设备、车载辅助电路)。

2. 小封装高密度

0402封装体积仅1.0mm×0.5mm×0.5mm(典型高度),大幅节省PCB空间,适配手机、智能穿戴、物联网终端等对体积敏感的产品设计。

3. 50V电压覆盖通用场景

额定电压50V高于常见3.3V/5V/12V系统工作电压,实际应用留有余量(建议降额至40V内),降低击穿风险,延长寿命。

4. ±10%精度平衡成本与性能

虽非高精度档位,但完全满足滤波、耦合等常规需求(如电源滤波、射频信号耦合),适合批量应用。

三、典型应用场景

该产品凭借小体积、宽温稳定等特点,广泛用于:

  • 消费电子:手机主板电源滤波、耳机接口静电防护、平板信号耦合;
  • 通信设备:路由器射频前端耦合、交换机电源模块高频滤波;
  • 工业控制:PLC信号处理、传感器滤波模块;
  • 物联网终端:智能门锁低功耗电路、温湿度传感器无线模块;
  • 汽车电子:车载中控辅助电路、倒车雷达信号滤波(部分型号支持汽车级认证)。

四、可靠性与质量保证

三环电子对该产品管控严格:

  • 环保合规:符合RoHS 2.0、REACH,无铅无卤;
  • 可靠性测试:通过高温存储(125℃×1000h)、温度循环(-55℃~+125℃×1000次)、湿度循环(85℃/85%RH×1000h)等测试,失效率低;
  • 产能稳定:成熟叠层生产线,年产能充足,满足批量订单。

五、选型与使用注意事项

1. 焊接工艺

  • 回流焊:峰值温度≤245℃,焊接时间≤10秒;
  • 波峰焊:小型化设备避免桥连,温度≤260℃;
  • 手工焊:恒温烙铁(≤350℃),焊接时间≤3秒。

2. 存储防护

  • 存储:25±5℃、40%~60%RH,开封后6个月内使用;
  • 高湿处理:暴露高湿环境后,105℃烘烤24h再焊接。

3. 电压降额

实际工作电压≤40V(额定80%),延长寿命。

该产品是平衡性能、成本与体积的通用型MLCC,适配多领域电子设计需求。

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