WMSIC Electronic Components

CCTC TCC0201X7R221K500ZT

ModelTCC0201X7R221K500ZT
Package0201
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC0201X7R221K500ZT
Type
CCTC
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0201X7R221K500ZT
Electronic Component
1
Electronic Component
220pF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM0265592783
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0201X7R221K500ZT 贴片电容产品概述

TCC0201X7R221K500ZT是三环电子(CCTC)推出的一款小型化贴片陶瓷电容,针对高密度PCB设计需求优化,兼顾温度稳定性与容值实用性,广泛应用于消费电子、可穿戴设备等领域。

一、产品基本定位

该电容属于通用型高频稳定陶瓷电容,核心解决小型化设备的滤波、耦合、信号匹配需求——既避免了NPO介质容值上限低的短板,又优于Y5V/Y5P介质的温度特性,是中低端电子设备的主流选型之一。

二、核心性能参数解析

1. 容值与精度

  • 标称容值:220pF(标识代码“221”,即22×10¹pF);
  • 精度等级:±10%(K档),满足大多数电路对容值偏差的要求(如滤波、耦合场景无需超高精度)。

2. 电压与温度特性

  • 额定电压:50V直流(DC),实际应用建议留20%余量(工作电压≤40V),避免击穿风险;
  • 温度系数:X7R,工作温度范围**-55℃~+125℃**,该范围内容值变化≤±15%,适配环境温度波动较大的场景(如工业传感器、车载辅助设备)。

3. 介质特性

采用X7R铁电陶瓷介质,容值随电压、频率有轻微变化,但整体稳定性远好于电解电容,适合10MHz以下的高频信号处理。

三、封装与物理特性

1. 封装规格

  • 封装类型:0201英制封装(对应公制0603),尺寸为0.508mm×0.254mm(长×宽);
  • 厚度:0.3mm,适配薄型PCB(如智能手机主板、可穿戴设备模组)。

2. 贴装兼容性

表面贴装(SMD)设计,兼容回流焊、波峰焊等自动化贴装工艺,适合大规模量产,焊接后无虚焊、脱落问题。

四、典型应用场景

  1. 消费电子:智能手机、平板电脑的音频滤波、射频前端耦合,蓝牙/WiFi模块的信号匹配;
  2. 可穿戴设备:智能手环、手表的电源滤波(50V电压余量充足)、传感器信号滤波;
  3. 小型电子模块:物联网节点、遥控器的振荡回路辅助电容;
  4. 一般工业控制:小型传感器节点的环境温度波动下的滤波电路(-55~125℃覆盖多数工业场景)。

五、品牌与可靠性优势

  1. 品牌背书:CCTC(三环电子)是国内知名元器件制造商,产品通过ISO9001、ISO14001认证,符合RoHS 2.0、REACH环保标准;
  2. 可靠性表现:
    • 焊接性能:回流焊后容值偏差≤±2%;
    • 抗应力能力:适配便携设备的振动环境(跌落测试符合行业标准);
    • 长期稳定性:1000小时老化后容值变化≤±2%。
  3. 批量一致性:同一批次容值偏差控制在±5%以内(优于标称±10%)。

六、选型与使用注意事项

  1. 电压余量:实际工作电压需低于额定电压的80%(≤40V),避免高压击穿;
  2. 温度适配:若工作温度超过125℃,需更换X8R或NPO介质电容;
  3. 焊接规范:遵循三环推荐的回流焊曲线(预热区150-180℃,峰值230-250℃,时间≤30秒),避免过温损坏;
  4. 存储条件:常温(15-35℃)、干燥(相对湿度≤60%)环境存储,开封后12个月内使用完毕。

总结

TCC0201X7R221K500ZT凭借小型化封装、宽温度范围、稳定容值特性,成为消费电子、可穿戴设备等领域的高性价比贴片电容选型,适配多数中低端电子设备的滤波、耦合需求。

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