WMSIC Electronic Components

CCTC TCC0805X7R105K250DTS

ModelTCC0805X7R105K250DTS
Package0805
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC0805X7R105K250DTS
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0805X7R105K250DTS
Electronic Component
1
Electronic Component
1uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.068g
Electronic Component
1
Electronic Component
BM0263668632
Electronic Component
X7R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0805X7R105K250DTS 产品概述

1. 产品简介

TCC0805X7R105K250DTS 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容(MLCC),具有高可靠性、优异的电气性能和广泛的应用范围。该电容采用 X7R 介质材料,具有稳定的温度特性和良好的电容值保持能力,适用于各种电子设备中的滤波、耦合、旁路等电路。

2. 主要参数

  • 商品分类: 贴片电容(MLCC)
  • 容值: 1uF
  • 材质(温度系数): X7R
  • 精度: ±10%
  • 额定电压: 25V
  • 封装: 0805

3. 产品特点

  • 高容值: 1uF 的容值在 0805 封装中属于较高水平,能够满足大多数电路设计的需求。
  • 稳定的温度特性: X7R 介质材料在 -55°C 至 +125°C 的温度范围内,电容值变化不超过 ±15%,确保在各种环境条件下都能稳定工作。
  • 高额定电压: 25V 的额定电压使其适用于多种低压和中压电路。
  • 紧凑封装: 0805 封装尺寸为 2.0mm x 1.25mm,适合高密度 PCB 布局,节省空间。
  • 高可靠性: 采用优质材料和先进制造工艺,确保产品具有长寿命和高可靠性。

4. 应用领域

TCC0805X7R105K250DTS 广泛应用于各种电子设备中,包括但不限于:

  • 消费电子: 如智能手机、平板电脑、笔记本电脑等。
  • 通信设备: 如路由器、交换机、基站等。
  • 工业控制: 如 PLC、传感器、电机驱动器等。
  • 汽车电子: 如车载娱乐系统、导航系统、车身控制模块等。
  • 医疗设备: 如监护仪、诊断设备、治疗设备等。

5. 技术规格

  • 电容值: 1uF
  • 温度系数: X7R
  • 精度: ±10%
  • 额定电压: 25V
  • 封装尺寸: 0805 (2.0mm x 1.25mm)
  • 工作温度范围: -55°C 至 +125°C
  • 介质材料: 陶瓷
  • 端子材料: 镍/锡

6. 产品优势

  • 高性能: 高容值和稳定的温度特性使其在各种应用中表现出色。
  • 高可靠性: 优质材料和先进工艺确保产品在恶劣环境下也能稳定工作。
  • 紧凑设计: 0805 封装适合高密度 PCB 布局,节省空间。
  • 广泛适用性: 适用于多种电子设备和应用场景。

7. 使用注意事项

  • 焊接条件: 建议使用回流焊或波峰焊,焊接温度曲线应符合相关标准。
  • 存储条件: 应存放在干燥、无尘、无腐蚀性气体的环境中,避免高温和高湿。
  • 使用环境: 避免在超出额定电压和温度范围的条件下使用,以免影响产品性能和寿命。

8. 结论

TCC0805X7R105K250DTS 是一款高性能、高可靠性的贴片多层陶瓷电容,适用于各种电子设备中的滤波、耦合、旁路等电路。其高容值、稳定的温度特性和紧凑封装使其成为工程师在设计电路时的理想选择。无论是在消费电子、通信设备、工业控制、汽车电子还是医疗设备中,TCC0805X7R105K250DTS 都能提供卓越的性能和可靠性。

通过以上概述,您可以全面了解 TCC0805X7R105K250DTS 的主要特点、技术规格和应用领域,为您的电路设计提供有力支持。

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