Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0402COG1R0B500AT是三环电子(CCTC) 推出的一款高精度多层陶瓷贴片电容(MLCC),核心参数清晰匹配工业与消费电子的精密需求:
C0G温度系数是该产品的核心竞争力——在-55℃至+125℃范围内,1pF电容的容值波动≤3fF(即±0.03%),远优于X7R(±15%)、Y5V(±20%)等电容,可避免温度变化对精密电路(如晶振、射频)的干扰。
0402封装体积紧凑,适配富士、西门子等自动化贴片机,贴装精度可达±0.05mm;兼容无铅回流焊工艺(峰值温度240~250℃,持续时间≤30s),符合RoHS 2.0、REACH环保标准。
三环采用全自动化叠层工艺,批次间容值、电压参数一致性好;绝缘电阻≥10⁹Ω(25℃/50V测试),可保障长期稳定运行。
用于石英晶振电路(如通信基站、工业PLC),容值稳定可确保振荡频率偏差≤±10ppm,满足时钟精度要求。
适配手机、WiFi模块的耦合、滤波环节,低损耗特性减少信号衰减,提升2.4GHz频段的信号覆盖范围。
在医疗监护仪(心电、血氧采集)、示波器中用于信号耦合,避免容值波动干扰微弱信号,保障测量精度(如心电信号精度±0.1mV)。
智能手机射频天线匹配、智能手表传感器滤波,0402封装缩小电路尺寸,50V电压满足中低压电源滤波需求。
通过ISO 9001质量管理体系、RoHS 2.0(无铅无镉)、REACH(SVHC合规)认证,符合欧盟、美国市场准入要求。
每批次抽样比例≥5%,检测容值、DF、ESR、电压等参数,合格率≥99.9%。
该产品凭借高精度、高稳定性与小型化优势,成为通信、医疗、消费电子等领域的优选电容之一。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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