WMSIC Electronic Components

CCTC TCC0805COG1R0C500BT

ModelTCC0805COG1R0C500BT
Package0805
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
CCTC TCC0805COG1R0C500BT
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0805COG1R0C500BT
Electronic Component
1
Electronic Component
1pF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.068g
Electronic Component
1
Electronic Component
BM0264458146
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0805COG1R0C500BT 产品概述

1. 产品简介

TCC0805COG1R0C500BT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容(MLCC),具有高稳定性和优异的温度特性。该电容采用 C0G(NP0)材质,容值为 1pF,额定电压为 50V,封装形式为 0805。C0G 材质以其极低的温度系数和出色的稳定性著称,适用于对温度变化敏感的高精度电路。

2. 主要特性

  • 容值:1pF
    该电容的容值为 1 皮法(pF),适用于高频电路和信号处理电路中需要极小电容值的场合。

  • 材质:C0G(NP0)
    C0G 材质是一种具有极低温度系数的陶瓷材料,其温度系数为 0 ±30ppm/°C,能够在宽温度范围内保持稳定的电容值。这种材质特别适合用于高精度、高稳定性的电路设计。

  • 额定电压:50V
    该电容的额定工作电压为 50V,能够满足大多数低压电路的需求。其设计确保了在额定电压下的长期稳定性和可靠性。

  • 封装:0805
    0805 封装是一种常见的贴片电容封装尺寸,尺寸为 2.0mm × 1.25mm。这种封装形式便于自动化贴片生产,广泛应用于各种电子设备中。

  • 品牌:CCTC(三环)
    CCTC(三环)是中国领先的电子元器件制造商,以其高质量和可靠性著称。该品牌的产品广泛应用于消费电子、通信设备、工业控制等领域。

3. 应用场景

TCC0805COG1R0C500BT 适用于多种高精度和高稳定性的电子电路,特别是在以下领域有广泛应用:

  • 高频电路:由于其极小的容值和低损耗特性,该电容非常适合用于射频(RF)电路、天线匹配电路、滤波器等高频应用中。
  • 信号处理电路:在模拟信号处理电路中,C0G 材质的电容能够提供稳定的电容值,确保信号的准确传输和处理。
  • 振荡电路:在晶体振荡器和时钟电路中,C0G 电容的稳定性能够确保振荡频率的准确性。
  • 精密仪器:在需要高精度和稳定性的测量仪器中,C0G 电容能够提供可靠的性能,确保测量结果的准确性。

4. 技术优势

  • 高稳定性:C0G 材质的温度系数极低,能够在 -55°C 至 +125°C 的宽温度范围内保持稳定的电容值,确保电路在各种环境条件下的可靠性。
  • 低损耗:C0G 材质的介电损耗极低,能够减少电路中的能量损耗,提高电路的效率。
  • 高可靠性:CCTC(三环)公司采用先进的生产工艺和严格的质量控制,确保该电容在长期使用中的高可靠性和长寿命。
  • 小型化设计:0805 封装形式便于自动化贴片生产,适用于高密度电路板设计,有助于减小电子设备的体积和重量。

5. 使用注意事项

  • 焊接条件:在焊接过程中,应遵循推荐的焊接温度曲线,避免过高的温度或过长的焊接时间,以防止对电容造成热损伤。
  • 存储环境:电容应存放在干燥、无尘的环境中,避免暴露在高温、高湿或腐蚀性气体中,以确保其性能不受影响。
  • 电路设计:在电路设计中,应充分考虑电容的额定电压和容值,确保其在电路中的正常工作条件,避免过压或过流导致的损坏。

6. 总结

TCC0805COG1R0C500BT 是一款高性能的贴片多层陶瓷电容,具有高稳定性、低损耗和高可靠性的特点。其 C0G 材质和 0805 封装形式使其广泛应用于高频电路、信号处理电路、振荡电路和精密仪器等领域。CCTC(三环)公司的品牌保证和先进的生产工艺确保了该电容在各种应用中的优异表现。无论是消费电子、通信设备还是工业控制,TCC0805COG1R0C500BT 都能提供可靠的电容解决方案,满足高精度和高稳定性的电路需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.