Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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TCC0805COG1R0C500BT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容(MLCC),具有高稳定性和优异的温度特性。该电容采用 C0G(NP0)材质,容值为 1pF,额定电压为 50V,封装形式为 0805。C0G 材质以其极低的温度系数和出色的稳定性著称,适用于对温度变化敏感的高精度电路。
容值:1pF
该电容的容值为 1 皮法(pF),适用于高频电路和信号处理电路中需要极小电容值的场合。
材质:C0G(NP0)
C0G 材质是一种具有极低温度系数的陶瓷材料,其温度系数为 0 ±30ppm/°C,能够在宽温度范围内保持稳定的电容值。这种材质特别适合用于高精度、高稳定性的电路设计。
额定电压:50V
该电容的额定工作电压为 50V,能够满足大多数低压电路的需求。其设计确保了在额定电压下的长期稳定性和可靠性。
封装:0805
0805 封装是一种常见的贴片电容封装尺寸,尺寸为 2.0mm × 1.25mm。这种封装形式便于自动化贴片生产,广泛应用于各种电子设备中。
品牌:CCTC(三环)
CCTC(三环)是中国领先的电子元器件制造商,以其高质量和可靠性著称。该品牌的产品广泛应用于消费电子、通信设备、工业控制等领域。
TCC0805COG1R0C500BT 适用于多种高精度和高稳定性的电子电路,特别是在以下领域有广泛应用:
TCC0805COG1R0C500BT 是一款高性能的贴片多层陶瓷电容,具有高稳定性、低损耗和高可靠性的特点。其 C0G 材质和 0805 封装形式使其广泛应用于高频电路、信号处理电路、振荡电路和精密仪器等领域。CCTC(三环)公司的品牌保证和先进的生产工艺确保了该电容在各种应用中的优异表现。无论是消费电子、通信设备还是工业控制,TCC0805COG1R0C500BT 都能提供可靠的电容解决方案,满足高精度和高稳定性的电路需求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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