WMSIC Electronic Components

CCTC TCC0805X7R152K500DT

ModelTCC0805X7R152K500DT
Package0805
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC0805X7R152K500DT
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0805X7R152K500DT
Electronic Component
1
Electronic Component
1.5nF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.068g
Electronic Component
1
Electronic Component
BM0264458218
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0805X7R152K500DT 多层陶瓷贴片电容(MLCC)产品概述

一、产品基本定义

TCC0805X7R152K500DT是CCTC(三环)电子推出的一款标准多层陶瓷贴片电容(MLCC),属于中低压、宽温稳定型无源器件。该型号遵循行业命名规则:

  • 前缀“TCC”为三环品牌标识;
  • “0805”对应英制封装尺寸(0.08×0.05英寸,公制2012规格,即2.0mm×1.25mm);
  • “X7R”为介质材料温度系数;
  • “152”表示容值(15×10²pF=1.5nF);
  • “K”代表容值精度±10%;
  • “500”为额定直流电压50V;
  • 后缀“DT”为三环内部产品系列及包装标识。

作为MLCC的典型应用型号,其核心定位是满足一般精度要求的中低压电路,兼顾宽温稳定性与小体积高密度特性。

二、核心参数详解

该型号的关键参数直接决定了其适用场景,具体如下:

1. 容值与精度

容值为1.5nF(1500pF),采用“152”容值编码(前两位有效数字+第三位10的幂次),精度等级为**±10%(K档)**。该精度属于MLCC的通用级,无需额外校准即可满足大多数滤波、耦合、旁路电路的需求,避免了高精度型号的成本冗余。

2. 额定电压

额定直流电压为50V,符合中低压电路的常规设计需求(如5V/12V/24V系统的电源滤波)。其击穿电压余量符合行业标准(通常为额定电压的1.5~2倍),可有效应对电路中的瞬态过压,提升系统可靠性。

3. 温度系数(X7R介质)

介质材料为X7R,是MLCC中最常用的宽温稳定介质之一,其特性为:

  • 工作温度范围:-55℃~+125℃;
  • 温度范围内容值变化率:±15%(相对于25℃基准)。
    相比Y5V等低稳定介质,X7R的容值随温度变化更小,适合户外、工业等宽温环境;相比NPO等高精度介质,其成本更低、容值密度更高。

4. 封装尺寸

采用0805贴片封装,公制尺寸为2.0mm(长)×1.25mm(宽)×0.8~1.0mm(厚,依批次略有差异)。该封装是电子设备小型化的主流选择,兼容自动化SMT生产线,可实现高密度贴装。

三、封装与制造工艺

TCC0805X7R152K500DT的结构与工艺体现了三环的量产优势:

  1. 多层叠层结构:采用陶瓷介质层与内电极交替叠层(通常10~20层),通过高温烧结形成一体化陶瓷体,实现小体积内的高容值;
  2. 电极材料:内电极采用镍(Ni)基材料,外电极采用“镍-锡”双层结构(部分批次为无铅锡银铜合金),符合RoHS 2.0环保标准,同时提升焊接兼容性;
  3. 端电极设计:端电极采用三层结构(铜/镍/锡),增强与PCB焊盘的结合力,减少焊接后脱落风险;
  4. 环保合规:无卤素、无铅,满足欧盟REACH法规及国内电子行业环保要求。

四、关键性能特点

该型号的核心优势可总结为以下三点:

1. 宽温稳定可靠

X7R介质的宽温特性使其可在**-55℃~+125℃**范围内稳定工作,容值变化控制在±15%以内,适合工业控制、汽车电子(非高压)等对温度敏感的场景;

2. 小体积高密度

0805封装实现了“小尺寸+1.5nF容值”的平衡,相比同容值的铝电解电容,体积缩小约90%,可显著降低PCB布局面积;

3. 高性价比与兼容性

  • 成本低于NPO高精度介质型号,适合大规模量产;
  • 兼容回流焊(峰值温度230~250℃)、波峰焊(需注意焊接时间),可与FR-4、陶瓷等PCB材料匹配;
  • 无极性设计,安装无需区分正负极,简化生产流程。

五、典型应用场景

结合参数特性,该型号主要应用于以下领域:

  1. 消费电子:手机、平板、笔记本电脑的电源滤波(如DC-DC转换模块旁路)、信号耦合(音频/射频链路);
  2. 工业控制:PLC、传感器、变频器的去耦电路(抑制电磁干扰)、辅助电源滤波;
  3. 通信设备:路由器、交换机的射频滤波(2.4G/5G频段)、电源模块旁路;
  4. 汽车电子(辅助系统):车载音响、中控屏的信号滤波(需确认工作温度符合车载要求);
  5. 智能家居:智能家电(空调、洗衣机)的控制电路滤波、传感器信号调理。

六、品牌与品质保障

CCTC(三环)是国内MLCC行业的主流制造商,具备10+年的叠层陶瓷电容生产经验,该型号的品质管控严格:

  1. 认证资质:通过ISO 9001质量管理体系、ISO 14001环境管理体系,部分批次满足IATF 16949汽车电子标准;
  2. 可靠性测试:出厂前需经过高低温循环(-55~125℃×100次)、湿度老化(85℃/85%RH×1000h)、耐电压测试(63V DC×1s)等,失效率低于0.1%;
  3. 包装方式:采用卷盘包装(10000个/盘,7英寸卷盘),符合SMT自动化生产要求,部分批次提供编带包装。

综上,TCC0805X7R152K500DT是一款性价比突出、宽温稳定的通用MLCC,可满足大多数中低压电子设备的滤波、耦合需求,是小型化设计的优选器件之一。

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