WMSIC Electronic Components

CCTC TCC0603COG680J500CT

ModelTCC0603COG680J500CT
Package0603
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC0603COG680J500CT
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0603COG680J500CT
Electronic Component
1
Electronic Component
68pF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264907437
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0603COG680J500CT 贴片多层陶瓷电容(MLCC)产品概述

一、产品基本信息

TCC0603COG680J500CT是三环电子(CCTC) 推出的高频稳定型贴片多层陶瓷电容(MLCC),属于C0G(NP0)系列核心产品。该电容采用0603(英制0.06×0.03英寸)标准贴片封装,专为对容值稳定性、损耗特性要求严苛的电路设计,额定直流电压50V,标称容值68pF,精度±5%(J档),广泛适配消费电子、工业控制、通信等领域的高频/精密电路需求。

二、核心性能参数详解

1. 容值与精度

标称容值为68pF,精度等级为J档(±5%),无需额外匹配补偿即可满足多数精密电路对容值偏差的要求,有效避免滤波、耦合功能的参数漂移。

2. 温度系数与宽温特性

采用C0G(NP0)温度系数,容值随温度变化极小:在-55℃~125℃宽温范围内,容值变化率≤±30ppm/℃,且损耗角正切值(tanδ)典型值≤0.0002,是高频振荡器、滤波器的理想选择。

3. 额定电压与绝缘特性

额定直流电压为50V DC,交流额定电压需按频率降额(如1kHz时约35V AC);绝缘电阻典型值≥10¹⁰Ω(25℃/1min),确保电路长期工作无漏电流干扰。

4. 损耗与Q值

高频下低损耗特性显著:1MHz频率下Q值典型值≥1000,有效降低信号传输损耗,提升射频电路的信号纯度。

三、封装与尺寸规格

该产品采用0603贴片封装(公制尺寸:1.6mm×0.8mm×0.8mm),符合EIA标准,适配常规贴片生产线的贴装工艺。封装结构为多层陶瓷叠层+镍/锡镀层端电极,端电极尺寸(焊盘)为0.3mm×0.5mm,兼具抗机械应力与耐焊接热冲击能力。

四、适用应用场景

因C0G的高稳定性与低损耗特性,主要应用于:

  1. 高频通信电路:蓝牙、WiFi、射频模块的信号耦合、滤波;
  2. 精密模拟电路:振荡器、锁相环(PLL)的谐振网络;
  3. 消费电子设备:智能手机、平板、智能穿戴的射频前端;
  4. 工业控制电路:PLC、传感器模块的抗干扰滤波;
  5. 通用汽车电子:车载信息娱乐系统的信号处理电路(车规级需求可联系厂商定制)。

五、产品优势与特点

  1. 温度稳定性优异:C0G系数使容值几乎不受温度变化影响,避免电路参数漂移;
  2. 低损耗高Q值:高频下损耗极小,提升信号传输效率与纯度;
  3. 小体积高集成:0603封装适配小型化设备的高密度贴装;
  4. 可靠性突出:三环成熟叠层工艺,通过高温存储、温度循环等可靠性测试;
  5. 环保合规:符合RoHS 2.0、REACH指令,无铅无卤,适配绿色制造需求。

六、使用注意事项

  1. 电压降额:实际直流电压建议≤40V(额定值80%),交流电压需按频率进一步降额;
  2. 焊接工艺:回流焊峰值温度≤260℃(时间≤10s),手工焊温度≤350℃(时间≤3s);
  3. 静电防护:MLCC对静电敏感,需采用ESD防护(接地工作台、防静电包装);
  4. 存储条件:常温干燥环境(25±5℃、湿度≤60%)存储,开封后1个月内使用完毕;
  5. 机械应力:避免过度弯折、挤压,防止陶瓷层开裂导致容值变化。

七、质量保障与认证

三环电子作为国内电容行业核心厂商,该产品通过以下认证与测试:

  • 质量体系:ISO 9001、IATF 16949(汽车电子级);
  • 可靠性测试:高温存储(125℃/1000h)、温度循环(-55℃~125℃/1000次)、湿度测试(85℃/85%RH/1000h);
  • 环保认证:RoHS 2.0、REACH SVHC清单合规。

该产品平衡了高稳定性、小体积与可靠性,是高频精密电路的高性价比选择。

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