Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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TCC0805X7R124K500DT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容器(MLCC),广泛应用于各种电子设备中。该电容器具有稳定的电气性能和高可靠性,适用于多种电路设计需求。
TCC0805X7R124K500DT 的标称容值为 120nF,精度为 ±10%。这意味着在实际应用中,电容值可能在 108nF 到 132nF 之间波动。这种精度范围适用于大多数通用电路设计,尤其是在对电容值要求不是特别严格的场合。
该电容器采用 X7R 材质,具有较好的温度稳定性。X7R 材质的温度系数为 ±15%,在 -55°C 到 +125°C 的温度范围内,电容值的变化不会超过 ±15%。这使得 TCC0805X7R124K500DT 适用于各种环境温度变化较大的应用场景。
TCC0805X7R124K500DT 的额定电压为 50V,这意味着在正常工作条件下,电容器可以承受的最大电压为 50V。超过这个电压可能会导致电容器损坏或性能下降。因此,在设计电路时,应确保工作电压不超过额定电压。
该电容器采用 0805 封装,尺寸为 2.0mm x 1.25mm。这种封装尺寸在贴片电容中属于中等大小,适用于大多数表面贴装技术(SMT)生产线。0805 封装具有良好的焊接性能和机械强度,适合高密度电路板设计。
TCC0805X7R124K500DT 广泛应用于各种电子设备中,包括但不限于:
TCC0805X7R124K500DT 由 CCTC(三环)公司生产,该公司在电子元器件领域具有较高的声誉和丰富的生产经验。CCTC 公司严格按照国际标准进行生产,确保产品的高质量和可靠性。此外,CCTC 公司还提供完善的售后服务和技术支持,确保客户在使用过程中无后顾之忧。
TCC0805X7R124K500DT 是一款性能稳定、可靠性高的贴片多层陶瓷电容器,适用于多种电子设备的设计需求。其 120nF 的容值、±10% 的精度、50V 的额定电压以及 0805 的封装尺寸,使其成为各种电路设计中的理想选择。无论是消费电子产品、通信设备、工业控制还是汽车电子,TCC0805X7R124K500DT 都能提供优异的电气性能和可靠的质量保证。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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