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CCTC TCC0603X5R105K100CT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC0603X5R105K100CT
- Type
- CCTC
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC0603X5R105K100CT
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264936560
- Electronic Component
- X5R
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0603X5R105K100CT 贴片电容产品概述
一、产品基本信息
TCC0603X5R105K100CT是三环电子（CCTC） 推出的通用型多层陶瓷贴片电容（MLCC），专为低压小型化电路设计。型号字符清晰对应核心参数：
- “0603”为英制封装代码（公制1608），尺寸小巧；
- “X5R”代表介质材料与温度特性；
- “105K”表示容值1μF（10×10⁵pF）、精度±10%；
- “100”对应额定电压10V DC；
- “CT”为产品系列标识，适配常规电子设备需求。
二、核心技术参数详解
该电容参数覆盖多数低压场景的基础要求，关键指标如下：
参数 详情 标称容值 1μF（10⁶pF） 精度 ±10%（K档标识） 额定电压 10V DC（实际工作需≤8V降额） 温度特性 X5R：-55℃~+85℃，容值变化≤±15% 封装尺寸 长1.6mm±0.2mm、宽0.8mm±0.2mm、厚0.8mm±0.1mm 环保标准 RoHS无铅、REACH合规 绝缘电阻 ≥10⁹Ω（25℃/10V）三、材料与结构特性
采用钛酸钡基陶瓷介质（X5R） 结合叠层工艺，实现高容量与小型化平衡：
- 介质优势：X5R介电常数（2000~4000）高于NP0，温度稳定性优于Y5V，成本适中，适合通用电路；
- 叠层结构：自动化叠层印刷镍电极与陶瓷介质，烧结后形成多层电容，0603封装下实现1μF容量；
- 焊接兼容：两端镀镍电极，适配SMT回流焊与手工焊，无极性设计简化安装。
四、适用应用场景
因体积小、电压适配性强，广泛用于以下领域：
- 消费电子：手机、平板的电源滤波（电池回路）、音频耦合；
- 智能穿戴：手环、手表的传感器信号去耦；
- 小型家电：遥控器、LED灯驱动的储能滤波；
- 工业控制：小型PLC、传感器节点的电磁干扰抑制；
- 通信设备：路由器、交换机的电源滤波（搭配小容量高频电容）。
五、可靠性与品质保障
三环电子对该产品实施全流程管控，确保稳定性：
- 工艺管控：叠层精度±1μm，烧结温度控制±1℃，保证介质厚度均匀；
- 可靠性测试：通过高温寿命（1000h@85℃/10V，容变≤±10%）、温度循环（500次-55~+85℃，容变≤±12%）、湿度负荷（1000h@60℃/90%RH）；
- 批次一致性：每批次抽样检测（AQL 2.5），参数偏差符合标准，满足量产需求。
六、选型与使用注意事项
为避免性能衰减，需注意以下要点：
- 电压降额：实际工作电压不超过8V（额定电压80%），防止介质击穿；
- 温度限制：环境温度需在-55~+85℃内，超出会导致容值大幅波动；
- 焊接规范：回流焊峰值230~245℃（≤30s），手工焊≤350℃（≤3s）；
- 储存条件：常温干燥（-40~+60℃，湿度≤60%），开封后12个月内使用；
- 极性：无极性电容，可任意方向焊接，无需区分正负极。
该产品凭借稳定性能、小巧封装与高性价比，成为低压电子设备的常用选择，适配多数常规电路的滤波、耦合与储能需求。
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