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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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TCC0202COG5R6C500AT是三环电子(CCTC) 推出的0402封装贴片多层陶瓷电容(MLCC),核心参数清晰明确:
C0G介质的核心优势是温度适应性极强:在-55℃至125℃的宽温度范围内,容值变化不超过0.03%,可彻底避免传统陶瓷电容因温度波动导致的信号偏差,尤其适合精密模拟电路、时钟振荡电路等对精度敏感的场景。
C0G属于低损耗介质,在1GHz以上高频场景下仍保持低ESR(等效串联电阻) 和高Q值(品质因数),可大幅减少信号传输中的能量损耗,提升射频电路的信号完整性(如5G模块、WiFi6前端)。
0402封装体积仅为传统直插电容的1/10,可显著节省PCB空间,完美适配智能手机、可穿戴设备、IoT传感器等对尺寸要求严苛的产品设计,助力终端设备实现轻薄化。
50V额定电压满足中低压电路的供电滤波、耦合需求;经三环电子可靠性测试,在125℃/50V条件下工作1000小时,容值变化≤±1%,绝缘电阻≥10^9Ω,符合工业级或部分汽车级(AEC-Q200)标准。
如手机5G射频模块、WiFi6路由器、蓝牙耳机的滤波/耦合电容,利用低损耗特性保障信号传输效率,避免信号衰减。
医疗设备(如血糖仪、心电仪)的传感器信号调理电路、音频解码电路,依赖C0G的温度稳定性维持信号精度,确保检测/输出无偏差。
智能手表、蓝牙耳机、智能手环的电源滤波、时钟电路,适配0402封装的高密度布局,满足终端设备“小体积、多功能”的设计需求。
PLC(可编程逻辑控制器)、变频器的信号耦合/去耦电容,宽温范围可适应-40℃至85℃的工业环境,保障设备长期稳定运行。
TCC0202COG5R6C500AT凭借温度稳定性、高频低损耗、小型化封装等核心优势,成为消费电子、通信、工业控制等领域的理想选择,可有效满足各类精密电路的设计需求,同时依托三环电子的产能与品质保障,降低终端产品的供应链风险。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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