WMSIC Electronic Components

CCTC TCC0402COG8R0B500AT

ModelTCC0402COG8R0B500AT
Package0402
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
CCTC TCC0402COG8R0B500AT
Type
CCTC
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0402COG8R0B500AT
Electronic Component
1
Electronic Component
8pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.012g
Electronic Component
1
Electronic Component
BM0265810870
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC002COG8R0B500AT 贴片多层陶瓷电容(MLCC)产品概述

一、产品核心属性

该产品为三环电子(CCTC) 推出的小型化MLCC,核心参数清晰明确:

  • 封装:0402英制(对应公制尺寸1.0mm×0.5mm×0.5mm),适配高密度贴装设计;
  • 容值:8pF(标识“8R0”中“R”代表小数点),典型精度±5%(C0G类电容精度普遍高于其他材质);
  • 额定电压:50V直流(标识“B500”中“500”对应50V),满足低压电路的常规电压需求;
  • 温度系数:C0G(原NP0类),符合IEC国际标准,是目前稳定性最优的陶瓷电容材质之一。

二、关键性能优势

C0G材质与0402封装的组合,赋予该产品显著的性能特点:

  1. 宽温容值稳定:在-55℃~125℃范围内,温度系数为±30ppm/℃,容值变化量不超过0.03%,无老化效应,长期使用无需担心容值漂移;
  2. 低损耗高频适配:射频频段(1GHz~5GHz)损耗角正切(tanδ)典型值<0.0002,可有效减少信号衰减,适合蓝牙、WiFi等高频电路;
  3. 电压特性线性:额定电压下,容值随直流偏置变化<0.1%,避免电压波动导致的电路性能偏差;
  4. 小型化高密度:0402封装体积仅为0402封装的一半左右,可提升PCB板的集成度,适配智能手机、智能穿戴等便携式设备。

三、典型应用场景

基于其性能特点,该产品广泛应用于以下领域:

  • 消费电子:智能手机射频前端滤波、蓝牙模块匹配网络、智能手表传感器信号调理;
  • 通信设备:基站射频单元耦合电容、光纤收发器滤波电路、路由器高频匹配;
  • 工业控制:PLC模拟量输入滤波、工业物联网网关射频模块、传感器信号稳定电路;
  • 医疗设备:精密监护仪信号滤波、医疗传感器信号调理(因容值稳定,适合医疗设备的高精度需求)。

四、可靠性与品质保障

三环电子作为国内MLCC主流供应商,该产品通过多重品质管控:

  • 认证体系:通过ISO9001、IATF16949(汽车级)认证,符合RoHS、REACH环保标准,无铅焊接兼容;
  • 参数冗余:50V额定电压设计,短期可承受63V峰值电压,提升电路抗过压能力;
  • 寿命耐久性:额定条件下(-55℃~125℃、50V),平均寿命可达10^6小时以上,满足长期稳定运行;
  • 一致性管控:全自动生产设备实现容值一致性偏差<±5%,避免批量应用中的性能差异。

五、选型与应用注意事项

  1. 封装匹配:需适配0402封装的贴片机吸嘴,PCB焊盘建议采用0.6mm×0.3mm尺寸,避免虚焊;
  2. 电压降额:实际工作电压建议不超过额定电压的80%(即40V),延长产品寿命;
  3. 精度确认:若电路对容值精度要求极高(如±0.1pF),需确认型号后缀“AT”对应的具体精度等级;
  4. 焊接工艺:采用回流焊时,峰值温度控制在230℃~250℃,焊接时间<30s,避免热应力导致陶瓷开裂。

该产品凭借稳定的性能、小型化设计与可靠的品质,成为精密电路、高频应用的高性价比选择,适配多领域的电子设备需求。

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