Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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TCC0603X7R564K250CT是CCTC(三环) 推出的一款0603封装多层片式陶瓷电容(MLCC),专为低压电子电路的滤波、去耦、耦合等场景设计,兼顾小型化与性能稳定性,广泛适配消费电子、工业控制等领域。
该产品关键参数明确,可直接匹配大部分常规电子电路需求:
参数项 具体规格 细节说明 标称容值 560nF 三位有效数字标识为“564”(56×10⁴ pF=560nF) 容值精度 ±10% 满足一般信号处理、电源滤波需求 额定直流电压 25V 工作电压需低于额定值,避免击穿 温度系数 X7R 温度范围-55℃~125℃,容值变化率±15%以内 封装类型 0603(1608) 英制0603对应公制1.6mm×0.8mm 电极结构 镍钯金(Ni/Pd/Au) 确保焊接可靠性与抗腐蚀性能 环保认证 RoHS 2.0、REACH 无铅无卤,符合欧盟环保要求0603封装是电子电路中应用最广泛的小型贴片封装之一,该产品尺寸符合行业标准:
封装适配回流焊工艺,焊接峰值温度建议控制在245℃±5℃,单个焊点焊接时间不超过10秒,兼容常规SMT生产线。
温度稳定性优异
X7R介质平衡性能与成本,在-55℃至125℃宽温范围内,容值变化率仅±15%,远优于Y5V等低价介质(容变可达±82%),适合环境温度波动较大的场景(如工业现场、户外设备)。
高频电气性能良好
MLCC本身具有低等效串联电阻(ESR) 和低等效串联电感(ESL) 特性,该产品在100kHz~1GHz频段内阻抗稳定,可有效抑制高频噪声,适配射频电路、高速数字电路滤波需求。
可靠性与一致性
CCTC采用自动化生产流程,确保每批次参数一致(容值、电压偏差控制在规格内);产品经过高温存储(125℃×1000h)、温度循环(-55℃~125℃×1000次) 等测试,失效率符合IEC 60384-1国际标准,适合长期稳定运行。
该产品因体积小、性能均衡,广泛应用于:
CCTC(三环)是国内MLCC头部制造商,拥有数十年生产经验,产品覆盖全系列封装,服务华为、小米等国内厂商及海外客户。
使用需注意:
该产品以高性价比、稳定性能成为常规电子电路优选MLCC,可满足中小批量至大规模生产需求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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