WMSIC Electronic Components

CCTC TCC0402COG131J500AT

ModelTCC0402COG131J500AT
Package0402
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC0402COG131J500AT
Type
CCTC
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0402COG131J500AT
Electronic Component
1
Electronic Component
130pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.012g
Electronic Component
1
Electronic Component
BM0265084165
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0402COG131J500AT 贴片多层陶瓷电容(MLCC)产品概述

TCC0402COG131J500AT是三环电子(CCTC) 推出的高频高稳定型贴片多层陶瓷电容(MLCC),针对温度稳定性、信号损耗要求严苛的电路设计,采用0402小型化封装,具备容值精度高、电压裕量充足等特点,广泛适配消费电子、射频通信、汽车电子等领域的小型化高密度电路。

一、产品基本属性与定位

该产品属于三环TCC系列高频MLCC,核心定位为精密信号处理与高频电路的稳定电容元件:

  • 封装类型:英制0402(对应公制1005,尺寸1.0mm×0.5mm×0.5mm);
  • 温度系数:C0G(EIA标准,对应IEC NP0);
  • 容值与精度:130pF(标识131),偏差±5%(标识J);
  • 额定电压:直流50V;
  • 环保认证:符合RoHS 2.0、REACH SVHC要求,无铅焊接兼容。

二、核心技术参数深度解析

1. 容值与精度

容值采用三位数字标识法:前两位“13”为有效数字,第三位“1”表示10的1次方,即13×10¹=130pF;精度标识“J”对应±5%,在-55℃~125℃范围内,容值偏差仍可控制在±0.05pF以内(典型值),满足精密电路对容值一致性的要求。

2. 温度系数(C0G)

C0G是MLCC中温度稳定性最优的系列,温度系数≤±30ppm/℃(温度每变化1℃,容值变化不超过30×10⁻⁶),且损耗角正切(tanδ)≤0.15%(1kHz/1Vrms条件下),远低于X7R等系列,适合高频信号传输时减少能量损耗。

3. 额定电压与可靠性

额定电压为直流50V,实际应用建议降额至40V以内(80%降额),可有效延长寿命;产品通过三环内部高温寿命测试(125℃/50V,1000小时),失效率低于0.1%,满足工业级可靠性要求。

4. 封装尺寸

0402封装是小型化设备主流封装,尺寸小巧(1.0mm×0.5mm),可显著提升PCB元件密度,适配智能手表、蓝牙耳机等便携设备的高密度设计。

三、关键性能优势

  1. 温度稳定性优异:C0G特性确保宽温范围内容值几乎无漂移,避免电路参数偏移,适用于户外、车载等温度波动场景;
  2. 低损耗高Q值:tanδ≤0.15%,Q值≥600(1kHz),射频电路中减少信号衰减,提升通信稳定性;
  3. 小型化与集成度高:0402封装适配高密度PCB布局,支持设备轻薄化;
  4. 可靠性与一致性好:三环成熟工艺确保每批次产品特性一致,减少电路调试成本;
  5. 环保与兼容性:无铅设计兼容主流回流焊,符合全球环保法规。

四、典型应用场景

  1. 高频振荡电路:石英晶体振荡器、LC振荡电路的匹配电容,稳定振荡频率(如智能手环时钟电路);
  2. 射频(RF)通信模块:WiFi、蓝牙、NFC模块的滤波/阻抗匹配网络,减少信号损耗(如手机射频前端);
  3. 精密模拟电路:运算放大器反馈电容、滤波器电容,确保信号精度(如医疗传感器调理电路);
  4. 汽车电子辅助电路:车身控制模块(BCM)小信号处理、胎压监测(TPMS)滤波电容;
  5. 消费电子便携设备:智能手表、TWS耳机的电源滤波、信号耦合电容。

五、选型与使用注意事项

  1. 电压降额:实际工作电压不超过40V(额定80%),避免过压击穿;
  2. 温度范围:确认环境温度在-55℃~125℃以内,超出可能影响性能;
  3. 焊接工艺:回流焊符合J-STD-020标准(峰值245℃±5℃,时间≤40秒),避免过温损坏;
  4. 极性确认:无极性MLCC,焊接无需区分正负极;
  5. 容值裕量:设计预留±5%偏差裕量,避免影响电路性能。

六、品牌与可靠性保障

三环电子(CCTC)是国内MLCC领先制造商,拥有20余年经验,产品通过ISO9001、IATF16949(汽车电子)认证,TCC系列经过温度循环、湿度老化、机械振动等严格测试,可满足工业级、消费级、汽车级多领域需求,为电路设计提供稳定可靠的电容解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.