Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0805X7R103K500DT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容(MLCC),广泛应用于各种电子设备中,用于滤波、去耦、储能等电路功能。该电容具有稳定的电气性能、高可靠性和优异的温度特性,适用于多种工业和消费电子产品。
TCC0805X7R103K500DT 的标称容值为 10nF,容值代码为 103。其精度为 ±10%,这意味着在实际应用中,电容的容值可能在 9nF 到 11nF 之间波动。这种精度水平适用于大多数通用电路设计,尤其是在对容值要求不十分严格的场合。
该电容采用 X7R 介质材料,具有以下温度特性:
TCC0805X7R103K500DT 的额定电压为 50V,这意味着在不超过 50V 的工作电压下,电容能够稳定工作,不会发生击穿或损坏。这一电压等级适用于大多数低电压电路设计,如消费电子产品、通信设备和工业控制系统。
该电容采用 0805 封装,尺寸为 2.0mm x 1.25mm。这种封装尺寸在贴片电容中属于中等大小,既保证了足够的电容量,又便于在紧凑的电路板上进行布局和焊接。0805 封装广泛应用于各种电子设备中,尤其是在空间有限的设计中。
TCC0805X7R103K500DT 适用于多种电子设备和电路,包括但不限于:
TCC0805X7R103K500DT 由 CCTC(三环)公司生产,三环是中国领先的电子元器件制造商之一,以其高质量和可靠性著称。三环的产品广泛应用于全球各地的电子设备中,深受客户信赖。
TCC0805X7R103K500DT 是一款高性能的贴片多层陶瓷电容,具有 10nF 的容值、±10% 的精度、50V 的额定电压和 X7R 的温度特性。其 0805 封装尺寸便于在紧凑的电路板上进行布局和焊接,广泛应用于电源管理、信号处理、通信设备、消费电子和工业控制等领域。由 CCTC(三环)公司生产,确保了产品的高质量和可靠性,是电子设计工程师的理想选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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