WMSIC Electronic Components

CCTC TCC1206X7R222K202HT

ModelTCC1206X7R222K202HT
Package1206
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC1206X7R222K202HT
Type
CCTC
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC1206X7R222K202HT
Electronic Component
1
Electronic Component
2.2nF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.066g
Electronic Component
1
Electronic Component
BM0264907387
Electronic Component
X7R
Voltage
2kV
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC1206X7R222K202HT 贴片陶瓷电容产品概述

一、核心参数规格

本型号为三环(CCTC)品牌的多层陶瓷贴片电容(MLCC),核心参数经行业标准规范定义,具体如下:

参数项 规格值 关键说明 容值 2.2nF(222K) 22×10²pF,精度±10%(K级) 额定电压 2kV(DC) 直流额定工作电压,支持中高压场景 温度系数 X7R 温度范围-55℃~+125℃,容值变化≤±15% 封装尺寸 1206(英制) 公制对应3216(3.2mm×1.6mm) 厚度 1.6mm 适配常规SMT工艺的标准厚度 介质类型 多层陶瓷(MLCC) 高绝缘性+耐高压的叠层结构 环保认证 RoHS 2.0、无铅(Pb-free) 符合欧盟环保要求

二、封装与结构特性

  1. 封装适配性
    采用1206标准贴片封装,尺寸紧凑(3.2mm长×1.6mm宽),厚度1.6mm,兼容绝大多数SMT生产线的贴装、焊接工艺,无需特殊工装调整,可直接集成于小型化PCB设计中。

  2. 多层陶瓷结构
    介质层采用X7R陶瓷材料,通过多层叠层工艺制成,电极采用镍基合金,兼具高绝缘性与耐高压特性,有效避免高压下的介质击穿风险;端电极采用“镍层+锡层”三层结构,焊接兼容性好,焊点可靠性高。

  3. 机械稳定性
    产品经过振动、跌落等可靠性测试,可承受常规工业环境下的机械应力,长期使用不易出现开裂、脱落问题。

三、性能优势解析

  1. 宽温稳定特性
    X7R温度系数确保电容在-55℃至+125℃的宽温范围内,容值变化控制在±15%以内,无需额外温度补偿电路,满足工业级、车载(部分场景)等环境的应用需求。

  2. 高压耐受力
    额定电压2kV(DC),结合多层陶瓷的绝缘设计,可稳定工作于中高压直流电路;同时具备一定过压耐受能力(需遵循降额原则),降低电路故障风险。

  3. 性价比优势
    容值精度±10%(K级),在满足大多数中低精度电路需求的前提下,成本低于高精度(±5%、±1%)型号,适合批量应用场景的成本控制。

  4. 品牌可靠性
    三环(CCTC)作为国内MLCC主流品牌,产品经过高温老化、湿度循环等严格测试,一致性好、可追溯性强,批量应用不良率低。

四、典型应用场景

本型号因高压特性与宽温稳定性,广泛应用于以下领域:

  1. 开关电源电路:AC-DC/DC-DC转换的高压滤波、EMI滤波,抑制电压纹波与电磁干扰;
  2. 工业控制设备:PLC、变频器、伺服驱动器的高压控制回路,实现信号耦合与滤波;
  3. 通信基站设备:射频前端高压偏置电路、电源模块高压滤波,适配基站宽温环境;
  4. 新能源设备:充电桩、光伏逆变器的高压DC链路滤波,提升电路稳定性;
  5. 医疗电子:部分低压医疗设备的辅助高压电路(需确认安全认证)、信号调理滤波。

五、选型与使用注意事项

  1. 电压降额:建议采用80%降额系数,实际工作电压≤1.6kV,延长产品寿命;
  2. 温度匹配:若环境温度接近+125℃,需核算容值变化对电路的影响,必要时补偿容值;
  3. 焊接工艺:回流焊峰值温度控制在230~245℃,时间≤40秒,避免过热开裂;
  4. 存储条件:未开封产品存储于-40℃~+85℃、湿度≤60%环境,开封后12个月内使用完毕;
  5. 电路匹配:根据电路阻抗、频率特性选择容值,避免不匹配导致信号失真。

本型号电容兼顾高压性能、宽温稳定性与成本优势,是中高压电路设计的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.