Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0603X7R103K500CT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容器(MLCC),具有优异的电气性能和可靠性,广泛应用于各种电子设备中。该电容器采用 X7R 介质材料,具有稳定的温度特性和较高的电容值,适用于多种电路设计需求。
TCC0603X7R103K500CT 的标称电容值为 10nF,精度为 ±10%。这意味着在实际应用中,电容值可能在 9nF 到 11nF 之间波动。这种精度水平适用于大多数通用电路设计,尤其是在对电容值要求不是特别严格的场合。
该电容器采用 X7R 介质材料,具有较好的温度稳定性。X7R 材料的温度系数为 ±15%,在 -55°C 到 +125°C 的温度范围内,电容值的变化不会超过 ±15%。这使得 TCC0603X7R103K500CT 适用于需要在较宽温度范围内保持稳定性能的应用场景。
TCC0603X7R103K500CT 的额定电压为 50V,这意味着它可以在不超过 50V 的电压下稳定工作。在实际应用中,建议留有一定的电压余量,以确保电容器的长期可靠性和安全性。
该电容器采用 0603 封装,尺寸为 1.6mm x 0.8mm。这种小型封装使得 TCC0603X7R103K500CT 非常适合高密度电路板设计,尤其是在空间受限的便携式电子设备中。
TCC0603X7R103K500CT 广泛应用于各种电子设备中,包括但不限于:
TCC0603X7R103K500CT 由 CCTC(三环)公司生产,该公司在电子元器件领域具有较高的声誉和丰富的经验。CCTC 的产品经过严格的质量控制和测试,确保其在高可靠性应用中的优异表现。
TCC0603X7R103K500CT 是一款性能稳定、可靠性高的贴片多层陶瓷电容器,适用于多种电子设备中的电路设计。其 10nF 的容值、±10% 的精度、50V 的额定电压以及 0603 的封装尺寸,使其成为高密度电路板设计的理想选择。无论是在消费电子、通信设备、工业控制还是汽车电子领域,TCC0603X7R103K500CT 都能提供卓越的性能和可靠性。
通过以上概述,可以看出 TCC0603X7R103K500CT 是一款在多种应用场景中都能发挥重要作用的电子元器件,其优异的性能和可靠性使其成为工程师和设计师的首选之一。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products